17663683. Semiconductor Package and Method simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
Semiconductor Package and Method
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Shu-Shen Yeh of Taoyuan City (TW)
Chien Hung Chen of Taipei (TW)
Po-Yao Lin of Zhudong Township (TW)
Semiconductor Package and Method - A simplified explanation of the abstract
This abstract first appeared for US patent application 17663683 titled 'Semiconductor Package and Method
Simplified Explanation
The abstract describes a semiconductor package with a recessed stiffener ring and a method of forming it. The package includes a substrate, a semiconductor die bonded to the substrate, an underfill between the die and substrate, and a stiffener ring attached to the substrate that encircles the die in a top view. The stiffener ring has a recess facing the die.
- The semiconductor package includes a substrate, semiconductor die, underfill, and stiffener ring.
- The stiffener ring is attached to the substrate and encircles the semiconductor die.
- The stiffener ring has a recess that faces the semiconductor die.
Potential Applications:
- This technology can be used in various electronic devices that require semiconductor packages, such as smartphones, tablets, computers, and other consumer electronics.
- It can also be applied in industrial applications where semiconductor packages are used, such as automotive electronics, aerospace systems, and medical devices.
Problems Solved:
- The recessed stiffener ring helps to provide additional support and protection to the semiconductor die, reducing the risk of damage during handling, transportation, and operation.
- It helps to improve the overall reliability and durability of the semiconductor package.
Benefits:
- The recessed stiffener ring enhances the structural integrity of the semiconductor package, reducing the risk of failure due to mechanical stress or impact.
- It allows for better thermal management by providing a pathway for heat dissipation from the semiconductor die.
- The recessed design also helps to minimize the overall package size, making it more compact and suitable for space-constrained applications.
Original Abstract Submitted
A semiconductor package including a recessed stiffener ring and a method of forming are provided. The semiconductor package may include a substrate, a semiconductor die bonded to the substrate, an underfill between the semiconductor die and the substrate, and a stiffener ring attached to the substrate, wherein the stiffener ring encircles the semiconductor die in a top view. The stiffener ring may include a recess that faces the semiconductor die.
