17840362. Molding Structures for Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Molding Structures for Integrated Circuit Packages and Methods of Forming the Same
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Shu-Shen Yeh of Taoyuan City (TW)
Chin-Hua Wang of New Taipei City (TW)
Chipta Priya Laksana of Taoyuan City (TW)
Po-Yao Lin of Zhudong Township (TW)
Molding Structures for Integrated Circuit Packages and Methods of Forming the Same - A simplified explanation of the abstract
This abstract first appeared for US patent application 17840362 titled 'Molding Structures for Integrated Circuit Packages and Methods of Forming the Same
Simplified Explanation
The abstract describes a method for forming a semiconductor device. Here is a simplified explanation of the abstract:
- The method involves attaching an integrated circuit die to an interposer, which is a substrate that provides electrical connections.
- An encapsulant is formed over the interposer and around the integrated circuit die. The top surface of the encapsulant and the top surface of the integrated circuit die are level, meaning they are at the same height.
- Recesses are then formed in the encapsulant, which are depressions or cavities in the material.
- Finally, the interposer is bonded to a package substrate, which is a larger substrate that provides further electrical connections. The recesses are positioned along the outer edge of the encapsulant after the bonding process.
Potential applications of this technology:
- Semiconductor devices manufacturing
- Electronics industry
Problems solved by this technology:
- Ensures a level surface between the encapsulant and the integrated circuit die, which can improve the overall performance and reliability of the semiconductor device.
- The recesses along the outer edge of the encapsulant provide additional space for electrical connections and can help in reducing the overall size of the device.
Benefits of this technology:
- Improved performance and reliability of semiconductor devices.
- Reduction in size of the device, allowing for more compact and efficient designs.
- Enhanced electrical connections and signal transmission due to the recesses in the encapsulant.
Original Abstract Submitted
In an embodiment, a method of forming a semiconductor device includes: attaching an integrated circuit die to an interposer; forming an encapsulant over the interposer and around the integrated circuit die, a top surface of the encapsulant and a top surface of the integrated circuit die being level; forming recesses in the encapsulant; and bonding the interposer to a package substrate, wherein after bonding the interposer to the package substrate, each of the recesses being along an outer edge of the encapsulant.
