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Category:H01L25/065
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Pages in category "H01L25/065"
The following 200 pages are in this category, out of 736 total.
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- 20240047303. SEMICONDUCTOR PACKAGE STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 20240047421. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 20240086345.MEMORY DEVICE INCLUDING PROCESSING CIRCUIT, AND ELECTRONIC DEVICE INCLUDING SYSTEM ON CHIP AND MEMORY DEVICE simplified abstract (samsung electronics co., ltd.)
- 20240087640.SEMICONDUCTOR DEVICE simplified abstract (samsung electronics co., ltd.)
- 20240087976.SEMICONDUCTOR PACKAGE simplified abstract (samsung electronics co., ltd.)
A
- Advanced micro devices, inc. (20240113070). INTEGRATING DEVICES INTO A CARRIER WAFER FOR THREE DIMENSIONALLY STACKED SEMICONDUCTOR DEVICES simplified abstract
- ADVANCED MICRO DEVICES, INC. patent applications on April 4th, 2024
- Apple inc. (20240096648). Seal Ring Designs Supporting Efficient Die to Die Routing simplified abstract
- Apple inc. (20240161804). Memory System Having Combined High Density, Low Bandwidth and Low Density, High Bandwidth Memories simplified abstract
- Apple inc. (20240162182). Asymmetric Stackup Structure for SoC Package Substrates simplified abstract
- Apple Inc. patent applications on February 8th, 2024
- Apple Inc. patent applications on March 21st, 2024
- Apple Inc. patent applications on May 16th, 2024
B
- Blockchain patent applications on 22nd Mar 2024
- Blockchain patent applications on April 11th, 2024
- Blockchain patent applications on April 18th, 2024
- Blockchain patent applications on April 25th, 2024
- Blockchain patent applications on April 4th, 2024
- Blockchain patent applications on February 1st, 2024
- Blockchain patent applications on February 22nd, 2024
- Blockchain patent applications on February 29th, 2024
- Blockchain patent applications on February 8th, 2024
- Blockchain patent applications on January 11th, 2024
- Blockchain patent applications on January 18th, 2024
- Blockchain patent applications on January 25th, 2024
- Blockchain patent applications on March 14th, 2024
- Blockchain patent applications on March 21st, 2024
- Blockchain patent applications on March 28th, 2024
- Blockchain patent applications on March 7th, 2024
- Blockchain patent applications on May 16th, 2024
- Blockchain patent applications on May 30th, 2024
H
- Huawei technologies co., ltd. (20240178103). Chip Stacked Structure and Manufacturing Method Thereof, Chip Package Structure, and Electronic Device simplified abstract
- Huawei technologies co., ltd. (20240178187). CHIP PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF, AND ELECTRONIC DEVICE simplified abstract
- Huawei Technologies Co., Ltd. patent applications on February 8th, 2024
- HUAWEI TECHNOLOGIES CO., LTD. patent applications on May 30th, 2024
I
- Intel corporation (20240105625). OPEN CAVITY INTERCONNECTS FOR MIB CONNECTIONS simplified abstract
- Intel corporation (20240105655). MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCONNECT simplified abstract
- Intel corporation (20240105677). RECONSTITUTED WAFER WITH SIDE-STACKED INTEGRATED CIRCUIT DIE simplified abstract
- Intel corporation (20240105700). SILICON CARBIDE POWER DEVICES INTEGRATED WITH SILICON LOGIC DEVICES simplified abstract
- Intel corporation (20240106139). CONNECTOR TO ELECTRICALLY COUPLE MULTIPLE SUBSTRATES simplified abstract
- Intel corporation (20240113006). PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER simplified abstract
- Intel corporation (20240113033). DYNAMIC RANDOM-ACCESS MEMORY IN A MOLDING BENEATH A DIE simplified abstract
- Intel corporation (20240113073). SIDE OF A DIE THAT IS COPLANAR WITH A SIDE OF A MOLDING simplified abstract
- Intel corporation (20240113075). MULTICHIP IC DEVICES WITH DIE EMBEDDED IN GLASS SUBSTRATE & A REDISTRIBUTION LAYER INTERCONNECT BRIDGE simplified abstract
- Intel corporation (20240114622). EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE ARCHITECTURE simplified abstract
- Intel corporation (20240128138). EMBEDDED DIE ARCHITECTURE AND METHOD OF MAKING simplified abstract
- Intel corporation (20240128181). PACKAGE SUBSTRATE WITH DUAL DAMASCENE BASED SELF-ALIGNED VIAS simplified abstract
- Intel corporation (20240128253). LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATION REMOVAL simplified abstract
- Intel corporation (20240128255). MICROELECTRONIC ASSEMBLIES simplified abstract
- Intel corporation (20240136269). ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE simplified abstract
- Intel corporation (20240136326). NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE ARCHITECTURES simplified abstract
- Intel corporation (20240162191). PACKAGE SUBSTRATE WITH ALTERNATING DIELECTRIC MATERIAL LAYER PAIRS simplified abstract
- Intel corporation (20240178084). INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES simplified abstract
- Intel corporation (20240178097). PERMANENT LAYER FOR BUMP CHIP ATTACH simplified abstract
- Intel corporation (20240178146). INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES simplified abstract
- Intel Corporation patent applications on April 18th, 2024
- Intel Corporation patent applications on April 25th, 2024
- Intel Corporation patent applications on April 4th, 2024
- Intel Corporation patent applications on February 29th, 2024
- Intel Corporation patent applications on January 18th, 2024
- Intel Corporation patent applications on January 25th, 2024
- Intel Corporation patent applications on March 14th, 2024
- Intel Corporation patent applications on March 28th, 2024
- Intel Corporation patent applications on May 16th, 2024
- Intel Corporation patent applications on May 30th, 2024
- International business machines corporation (20240096783). FLEXIBLE WIRING ARCHITECTURE FOR MULTI-DIE INTEGRATION simplified abstract
- International business machines corporation (20240112965). TRENCH STRUCTURE FOR SEMICONDUCTOR DEVICE simplified abstract
- International business machines corporation (20240113013). SEMICONDUCTOR STRUCTURES WITH STACKED INTERCONNECTS simplified abstract
- International business machines corporation (20240113055). STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS simplified abstract
- International business machines corporation (20240113076). INTRA-BONDING SEMICONDUCTOR INTEGRATED CIRCUIT CHIPS simplified abstract
- International business machines corporation (20240162192). STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT simplified abstract
- International Business Machines Corporation patent applications on April 4th, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on February 1st, 2024
- International Business Machines Corporation patent applications on February 29th, 2024
- International Business Machines Corporation patent applications on March 21st, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on May 16th, 2024
K
- Kioxia corporation (20240096821). SEMICONDUCTOR STORAGE DEVICE simplified abstract
- Kioxia corporation (20240098999). SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICE simplified abstract
- Kioxia corporation (20240099004). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Kioxia corporation (20240099013). SEMICONDUCTOR MEMORY DEVICE simplified abstract
- Kioxia corporation (20240099031). SEMICONDUCTOR MEMORY DEVICE simplified abstract
- Kioxia corporation (20240099032). SEMICONDUCTOR STORAGE DEVICE simplified abstract
- Kioxia corporation (20240099033). SEMICONDUCTOR MEMORY DEVICE simplified abstract
- Kioxia Corporation patent applications on March 21st, 2024
M
- Micron technology, inc. (20240126692). MEMORY WITH POST-PACKAGING MASTER DIE SELECTION simplified abstract
- Micron technology, inc. (20240128182). DIELECTRIC INTERPOSER WITH ELECTRICAL-CONNECTION CUT-IN simplified abstract
- Micron technology, inc. (20240178148). ETCH-BACK OPENING WITH PROTECTIVE FILL STRUCTURE simplified abstract
- Micron technology, inc. (20240178189). APPARATUSES INCLUDING REDISTRIBUTION LAYERS AND EMBEDDED INTERCONNECT STRUCTURES simplified abstract
- Micron Technology, Inc. patent applications on April 18th, 2024
- Micron Technology, Inc. patent applications on February 15th, 2024
- Micron Technology, Inc. patent applications on February 1st, 2024
- Micron Technology, Inc. patent applications on February 29th, 2024
- Micron Technology, Inc. patent applications on February 8th, 2024
- Micron Technology, Inc. patent applications on March 14th, 2024
- Micron Technology, Inc. patent applications on May 30th, 2024
- Microsoft Technology Licensing, LLC patent applications on February 29th, 2024
- Murata Manufacturing Co., Ltd. patent applications on January 18th, 2024
Q
- Qualcomm incorporated (20240096845). CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD OF MANUFACTURE simplified abstract
- Qualcomm incorporated (20240105762). VERTICALLY INTEGRATED DEVICE STACK INCLUDING SYSTEM ON CHIP AND POWER MANAGEMENT INTEGRATED CIRCUIT simplified abstract
- QUALCOMM Incorporated patent applications on February 1st, 2024
- QUALCOMM Incorporated patent applications on February 29th, 2024
- QUALCOMM Incorporated patent applications on January 18th, 2024
- QUALCOMM Incorporated patent applications on March 14th, 2024
- QUALCOMM Incorporated patent applications on March 21st, 2024
- QUALCOMM Incorporated patent applications on March 28th, 2024
- Quantum Computing patent applications on February 1st, 2024
S
- Samsung electronics co., ltd. (20240096420). NONVOLATILE MEMORY DEVICE AND METHOD OF OPERATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240096717). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240096728). SEMICONDUCTOR PACKAGES simplified abstract
- Samsung electronics co., ltd. (20240096777). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240096820). METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING SACRIFICIAL LAYER AND SEMICONDUCTOR PACKAGE MANUFACTURED BY USING THEREOF simplified abstract
- Samsung electronics co., ltd. (20240096831). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240096840). SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240096841). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240096851). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240098996). THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240105267). NON-VOLATILE MEMORY DEVICE simplified abstract
- Samsung electronics co., ltd. (20240105603). SEMICONDUCTOR DEVICE INCLUDING VARIABLE RESISTANCE PATTERN AND ELECTRONIC SYSTEM INCLUDING THE SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240105636). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240105650). SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR CHIPS simplified abstract
- Samsung electronics co., ltd. (20240105679). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240105680). SEMICONDUCTOR CHIP STACK STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240107763). SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240113001). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240113003). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240113074). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240113077). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240120007). SEMICONDUCTOR MEMORY DEVICE, METHOD FOR FABRICATING THE SAME AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240120251). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240120263). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240120299). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240120318). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240120319). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240128135). SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240128145). SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240128155). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240128173). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240128195). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240128221). SEMICONDUCTOR PACKAGE INCLUDING BUMPS WITH A PLURALITY OF SEPARATION DISTANCES simplified abstract
- Samsung electronics co., ltd. (20240128225). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240128230). SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHOD USING PULSED LIGHT IRRADIATION, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240128234). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240128236). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240128239). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240130122). THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240130123). SEMICONDUCTOR DEVICE, ELECTRONIC SYSTEM INCLUDING THE SAME, AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240136250). SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract
- Samsung electronics co., ltd. (20240136255). INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240136327). MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240136329). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240136331). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240136334). SEMICONDUCTOR PACKAGES simplified abstract
- Samsung electronics co., ltd. (20240138157). THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE ANDELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240162115). SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240162135). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240162181). SEMICONDUCTOR PACKAGES simplified abstract
- Samsung electronics co., ltd. (20240162184). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240162188). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240162193). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240162194). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240162195). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240164091). SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240164094). SEMICONDUCTOR MEMORY DEVICES AND ELECTRONIC SYSTEMS INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240164101). THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240178117). SEMICONDUCTOR PACKAGES simplified abstract
- Samsung electronics co., ltd. (20240178185). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240178188). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240178191). SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240179910). SEMICONDUCTOR MEMORY DEVICE, METHOD FOR FABRICATING THE SAME AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240179913). SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING SEMICONDUCTOR DEVICE simplified abstract
- SAMSUNG ELECTRONICS CO., LTD. patent applications on April 11th, 2024
- Samsung Electronics Co., Ltd. patent applications on April 18th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on April 25th, 2024
- Samsung Electronics Co., Ltd. patent applications on April 4th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 15th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 1st, 2024
- Samsung Electronics Co., Ltd. patent applications on February 29th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 8th, 2024
- Samsung Electronics Co., Ltd. patent applications on January 18th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on January 25th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 14th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 21st, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 28th, 2024
- Samsung Electronics Co., Ltd. patent applications on May 16th, 2024
- Samsung Electronics Co., Ltd. patent applications on May 30th, 2024
- Sk hynix inc. (20240120285). SUBSTRATE HAVING A DIE POSITION MARK AND A SEMICONDUCTOR DIE STACK STRUCTURE INCLUDING SEMICONDUCTOR DIES STACKED ON THE SUBSTRATE simplified abstract
- Sk hynix inc. (20240159823). SEMICONDUCTOR DEVICE HAVING DEFECT DETECTION CIRCUIT simplified abstract
- Sk hynix inc. (20240178172). SEMICONDUCTOR DEVICE INCLUDING RESISTOR ELEMENT simplified abstract
- SK hynix Inc. patent applications on April 11th, 2024
- SK hynix Inc. patent applications on January 18th, 2024
- SK hynix Inc. patent applications on May 16th, 2024
- SK hynix Inc. patent applications on May 30th, 2024
T
- Taiwan semiconductor manufacturing co., ltd. (20240096719). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096722). Fan-Out Stacked Package and Methods of Making the Same simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096731). SEMICONDUCTOR PACKAGE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096811). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096822). PACKAGE STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096830). Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096848). INTEGRATED CIRCUIT PACKAGE AND METHOD simplified abstract