Micron technology, inc. (20240126692). MEMORY WITH POST-PACKAGING MASTER DIE SELECTION simplified abstract

MEMORY WITH POST-PACKAGING MASTER DIE SELECTION

Organization Name

micron technology, inc.

Inventor(s)

Evan C. Pearson of Boise ID (US)

John H. Gentry of Boise ID (US)

Michael J. Scott of Boise ID (US)

Greg S. Gatlin of Mountain Home ID (US)

Lael H. Matthews of Meridian ID (US)

Anthony M. Geidl of Boise ID (US)

Michael Roth of Boise ID (US)

Markus H. Geiger of Boise ID (US)

Dale H. Hiscock of Boise ID (US)

MEMORY WITH POST-PACKAGING MASTER DIE SELECTION - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240126692 titled 'MEMORY WITH POST-PACKAGING MASTER DIE SELECTION

Simplified Explanation

The patent application describes memory devices and systems with post-packaging master die selection. In one embodiment, a memory device includes multiple memory dies, each with a command/address decoder. The decoders receive signals from external contacts and transmit them to other memory dies. Each memory die also has circuitry to enable or disable individual decoders after packaging.

• Memory device with post-packaging master die selection:

   - Includes multiple memory dies with command/address decoders
   - Decoders receive signals from external contacts and transmit to other dies
   - Circuitry enables/disables decoders after packaging

Potential Applications

This technology could be applied in various memory devices such as solid-state drives, servers, and data centers.

Problems Solved

This innovation solves the problem of efficiently selecting a master die in a memory device after packaging, improving overall performance and reliability.

Benefits

- Enhanced command/address decoding efficiency - Improved communication between memory dies - Increased reliability and performance of memory devices

Potential Commercial Applications

"Post-Packaging Master Die Selection in Memory Devices" could find applications in the semiconductor industry, data storage solutions, and computer hardware manufacturing.

Possible Prior Art

There may be prior art related to memory devices with post-packaging die selection methods, but specific examples are not provided in this patent application.

How does this technology impact the overall cost of memory devices?

The cost implications of implementing post-packaging master die selection in memory devices are not addressed in the patent application. This aspect would be crucial for understanding the economic feasibility of adopting this technology.

What are the potential challenges in integrating this innovation into existing memory device manufacturing processes?

The patent application does not discuss the potential hurdles or complexities that may arise when incorporating post-packaging master die selection into current memory device production lines. Understanding these challenges would be essential for successful implementation.

Original Abstract Submitted

memory devices and systems with post-packaging master die selection, and associated methods, are disclosed herein. in one embodiment, a memory device includes a plurality of memory dies. each memory die of the plurality includes a command/address decoder. the command/address decoders are configured to receive command and address signals from external contacts of the memory device. the command/address decoders are also configured, when enabled, to decode the command and address signals and transmit the decoded command and address signals to every other memory die of the plurality. each memory die further includes circuitry configured to enable, or disable, or both individual command/address decoders of the plurality of memory dies. in some embodiments, the circuitry can enable a command/address decoder of a memory die of the plurality after the plurality of memory dies are packaged into a memory device.