Samsung electronics co., ltd. (20240128155). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240128155 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Simplified Explanation
The semiconductor package described in the abstract includes a redistribution structure with a redistribution pattern and insulation layer, a semiconductor chip with an active and inactive surface, a molding layer covering the chip, and a silicon heat dissipation structure bonded to the chip through Si-to-Si direct bonding.
- The semiconductor package includes a redistribution structure with a redistribution pattern and insulation layer.
- The semiconductor chip has an active surface and an inactive surface.
- A molding layer covers at least a portion of the semiconductor chip.
- A silicon heat dissipation structure is bonded to the semiconductor chip through Si-to-Si direct bonding.
Potential Applications
This technology could be applied in:
- High-performance computing devices
- Advanced consumer electronics
- Automotive electronics
Problems Solved
This technology helps in:
- Improving heat dissipation in semiconductor devices
- Enhancing overall performance and reliability of electronic systems
Benefits
The benefits of this technology include:
- Efficient heat dissipation
- Increased performance and longevity of semiconductor devices
- Enhanced reliability under high-stress conditions
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Semiconductor manufacturing industry
- Electronics cooling systems market
- Aerospace and defense sector
Possible Prior Art
One possible prior art in this field is the use of traditional heat sinks and fans for heat dissipation in semiconductor devices.
Unanswered Questions
How does this technology compare to traditional heat dissipation methods in terms of efficiency and cost-effectiveness?
This article does not provide a direct comparison between this technology and traditional heat dissipation methods. Further research and testing would be needed to determine the efficiency and cost-effectiveness of this technology compared to traditional methods.
What are the potential challenges in implementing Si-to-Si direct bonding in semiconductor packaging processes?
The article does not address the potential challenges in implementing Si-to-Si direct bonding. Some challenges could include process complexity, material compatibility issues, and scalability of the bonding process. Further research and development would be required to overcome these challenges.
Original Abstract Submitted
provided is a semiconductor package comprising a redistribution structure including a redistribution pattern and a redistribution insulation layer covering the redistribution pattern, a semiconductor chip disposed on the redistribution structure and having an active surface and an inactive surface opposite to the active surface, a molding layer disposed on the redistribution structure and covering at least a portion of the semiconductor chip, and a silicon heat dissipation structure disposed on the semiconductor chip, wherein the silicon heat dissipation structure is bonded to the semiconductor chip through silicon (si)-to-si direct bonding.
