Sk hynix inc. (20240120285). SUBSTRATE HAVING A DIE POSITION MARK AND A SEMICONDUCTOR DIE STACK STRUCTURE INCLUDING SEMICONDUCTOR DIES STACKED ON THE SUBSTRATE simplified abstract
Contents
- 1 SUBSTRATE HAVING A DIE POSITION MARK AND A SEMICONDUCTOR DIE STACK STRUCTURE INCLUDING SEMICONDUCTOR DIES STACKED ON THE SUBSTRATE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE HAVING A DIE POSITION MARK AND A SEMICONDUCTOR DIE STACK STRUCTURE INCLUDING SEMICONDUCTOR DIES STACKED ON THE SUBSTRATE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SUBSTRATE HAVING A DIE POSITION MARK AND A SEMICONDUCTOR DIE STACK STRUCTURE INCLUDING SEMICONDUCTOR DIES STACKED ON THE SUBSTRATE
Organization Name
Inventor(s)
Bok Gyu Min of Icheon-si Gyeonggi-do (KR)
Beom Sang Cho of Icheon-si Gyeonggi-do (KR)
SUBSTRATE HAVING A DIE POSITION MARK AND A SEMICONDUCTOR DIE STACK STRUCTURE INCLUDING SEMICONDUCTOR DIES STACKED ON THE SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240120285 titled 'SUBSTRATE HAVING A DIE POSITION MARK AND A SEMICONDUCTOR DIE STACK STRUCTURE INCLUDING SEMICONDUCTOR DIES STACKED ON THE SUBSTRATE
Simplified Explanation
The abstract describes a substrate with specific alignment and position marks for die stacking.
- The substrate includes a first die alignment mark with a cross shape and a first die position mark with a main position mark and a branch position mark.
- The first die alignment mark has a vertical and horizontal bar intersecting perpendicularly.
- The first die position mark has different areas for the main position mark and the branch position mark.
Potential Applications
This technology could be used in semiconductor manufacturing for precise alignment and positioning of dies in a stack.
Problems Solved
This technology solves the problem of accurately aligning and positioning dies in a stack during manufacturing processes.
Benefits
The benefits of this technology include improved accuracy, efficiency, and reliability in die stacking processes.
Potential Commercial Applications
A potential commercial application of this technology could be in the production of advanced electronic devices requiring precise die stacking.
Possible Prior Art
One possible prior art could be the use of similar alignment and position marks in semiconductor manufacturing processes.
Unanswered Questions
How does this technology impact the overall cost of manufacturing electronic devices?
This article does not address the potential cost implications of implementing this technology in manufacturing processes.
Are there any limitations to the size or type of dies that can be used with this substrate?
The article does not provide information on any limitations regarding the size or type of dies compatible with this substrate.
Original Abstract Submitted
a substrate includes: a first die alignment mark and a first die position mark defining a die stack region. the first die alignment mark has substantially a cross shape having substantially a vertical bar and substantially a horizontal bar intersecting each other substantially perpendicularly, and the first die position mark includes a first main position mark having a first area and a first branch position mark having a second area different from the first area.
