Samsung electronics co., ltd. (20240096840). SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
Contents
- 1 SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this technology compare to existing semiconductor chip designs in terms of performance and efficiency?
- 1.11 What are the specific manufacturing processes involved in implementing this unique layout design for semiconductor chips?
- 1.12 Original Abstract Submitted
SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Organization Name
Inventor(s)
SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096840 titled 'SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Simplified Explanation
The semiconductor device described in the abstract includes a first semiconductor chip with a quadrangle shape from a plan view. The chip has a first semiconductor substrate with a first surface and a second surface, a first active layer adjacent to the first surface, a first through electrode penetrating the substrate and connected to the active layer, a second chip connection pad on the second surface connected to the through electrode, a first dummy pattern on the second surface outside the chip connection pad, and a first chip connection pad on the first surface connected to the through electrode.
- First semiconductor chip with a quadrangle shape
- First through electrode connected to the first active layer
- Second chip connection pad on the second surface
- First dummy pattern on the second surface
- First chip connection pad on the first surface
Potential Applications
The technology described in the patent application could be applied in the manufacturing of semiconductor devices, integrated circuits, and electronic components.
Problems Solved
This technology helps in improving the connectivity and efficiency of semiconductor devices by providing a unique layout design for the chip connection pads and through electrodes.
Benefits
The benefits of this technology include enhanced performance, increased reliability, and improved signal transmission in semiconductor devices.
Potential Commercial Applications
The semiconductor device innovation could find applications in the consumer electronics industry, telecommunications sector, and automotive electronics market.
Possible Prior Art
One possible prior art for this technology could be the use of dummy patterns in semiconductor devices to improve signal integrity and reduce noise interference.
Unanswered Questions
How does this technology compare to existing semiconductor chip designs in terms of performance and efficiency?
The article does not provide a direct comparison between this technology and existing semiconductor chip designs. Further research and testing would be needed to evaluate the performance and efficiency of this innovation in comparison to current designs.
What are the specific manufacturing processes involved in implementing this unique layout design for semiconductor chips?
The article does not delve into the specific manufacturing processes required to implement this layout design. Understanding the manufacturing steps and techniques involved would be crucial for companies looking to adopt this technology in their semiconductor production.
Original Abstract Submitted
a semiconductor device includes a first semiconductor chip. the first semiconductor chip includes a first semiconductor substrate having a first surface and a second surface opposite to the first surface, and having a first active layer adjacent to the first surface, the first semiconductor substrate having a quadrangle shape from a plan view; a first through electrode penetrating at least a portion of the first semiconductor substrate and connected to the first active layer; a second chip connection pad on the second surface of the first semiconductor substrate and connected to the first through electrode; a first dummy pattern positioned outside the second chip connection pad on the second surface of the first semiconductor substrate from the plan view, the first dummy pattern comprising a line pattern extending horizontally along the second surface of the first semiconductor substrate; and a first chip connection pad on the first surface of the first semiconductor substrate and connected to the first through electrode. the first dummy pattern is disposed adjacent to at least one side of four sides of the quadrangle shape of the first semiconductor substrate from the plan view.
