Samsung electronics co., ltd. (20240113077). SEMICONDUCTOR PACKAGE simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240113077 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract consists of multiple stacked semiconductor chips, with each chip having a circuit layer, through-silicon via, and bump pad on the substrate. The uppermost chip includes a thermal path via in the substrate.
- The semiconductor package includes a plurality of first semiconductor chips stacked one on top of the other.
- Each first semiconductor chip has a circuit layer, through-silicon via, and bump pad on the substrate.
- The uppermost chip in the stack is a second semiconductor chip with a circuit layer and a thermal path via in the substrate.
Potential Applications
The technology described in this patent application could be applied in:
- High-performance computing systems
- Data centers
- Telecommunications equipment
Problems Solved
This technology addresses the following issues:
- Heat dissipation in stacked semiconductor packages
- Increasing circuit density in a compact form factor
Benefits
The benefits of this technology include:
- Improved thermal management
- Enhanced performance and reliability of semiconductor packages
- Increased functionality in a smaller footprint
Potential Commercial Applications
The semiconductor package innovation could find commercial applications in:
- Server systems
- Networking devices
- Automotive electronics
Possible Prior Art
One possible prior art related to this technology is the use of thermal vias in semiconductor packages to improve heat dissipation.
Unanswered Questions
How does this technology impact power consumption in semiconductor packages?
The article does not delve into the potential effects of this technology on power usage in semiconductor packages.
What are the cost implications of implementing this technology in mass production?
The article does not discuss the cost factors associated with integrating this innovation into large-scale manufacturing processes.
Original Abstract Submitted
a semiconductor package includes a plurality of first semiconductor chips sequentially stacked, each of the first semiconductor chips including a circuit layer on a first surface of a first substrate, a through-silicon via passing through the first substrate, and a bump pad connected to the through-silicon via, and a second semiconductor chip on an uppermost first semiconductor chip, the second semiconductor chip including a circuit layer on a first surface of a second substrate, and a thermal path via in the second substrate.
