Kioxia corporation (20240099004). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract

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SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Organization Name

kioxia corporation

Inventor(s)

Tomoya Sanuki of Yokkaichi (JP)

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240099004 titled 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Simplified Explanation

The semiconductor device described in the patent application includes a first substrate with control circuits, memory cell arrays, and pads in different regions on its surface, as well as connection lines to connect the pads.

  • The device features a first substrate with distinct regions for control circuits, memory cell arrays, and pads.
  • The memory cell arrays are positioned above the control circuits and connected to them.
  • Pads are located above the memory cell arrays and connected to the control circuits.
  • A connection line runs above the memory cell arrays to link the pads.

Potential Applications

This technology could be applied in:

  • Memory devices
  • Integrated circuits
  • Semiconductor manufacturing

Problems Solved

This technology helps address issues related to:

  • Efficient memory cell array organization
  • Improved connectivity within semiconductor devices
  • Enhanced control circuit functionality

Benefits

The benefits of this technology include:

  • Higher performance in memory devices
  • Increased efficiency in semiconductor manufacturing
  • Enhanced overall functionality of integrated circuits

Potential Commercial Applications

The potential commercial applications of this technology could be seen in:

  • Consumer electronics
  • Automotive electronics
  • Telecommunications industry

Possible Prior Art

One possible prior art for this technology could be the development of memory cell array organization techniques in semiconductor devices.

Unanswered Questions

How does this technology compare to existing memory cell array organization methods?

This article does not provide a direct comparison with existing methods, leaving the reader to wonder about the specific advantages of this new approach.

What are the specific technical specifications of the control circuits and memory cell arrays in this semiconductor device?

The article does not delve into the technical details of the control circuits and memory cell arrays, leaving room for further exploration into their design and capabilities.


Original Abstract Submitted

in one embodiment, a semiconductor device includes a first substrate including first and second regions on its surface, a first control circuit on the first substrate in the first region, a first memory cell array above the first control circuit in the first region and connected to the first control circuit, and a first pad above the first memory cell array in the first region and connected to the first control circuit. the device further includes a second control circuit on the first substrate in the second region, a second memory cell array above the second control circuit in the second region and connected to the second control circuit, a second pad above the second memory cell array in the second region and connected to the second control circuit, and a connection line above the first and second memory cell arrays and connecting the first and second pads.