Qualcomm incorporated (20240096845). CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD OF MANUFACTURE simplified abstract
Contents
- 1 CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD OF MANUFACTURE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD OF MANUFACTURE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD OF MANUFACTURE
Organization Name
Inventor(s)
Yangyang Sun of San Diego CA (US)
Dongming He of San Diego CA (US)
CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD OF MANUFACTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096845 titled 'CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD OF MANUFACTURE
Simplified Explanation
The patent application describes a circuit package with a polymer layer around the bump interconnects to reduce shorts between the interconnects and prevent underfill delamination. The polymer layer is placed on the surface of the first component and around the bump interconnects, as well as on the side surfaces of the interconnects.
- The circuit package includes a first component connected to a second component through bump interconnects.
- The bump interconnects pass logic signals, data signals, and power between the components.
- The polymer layer reduces shorts between adjacent bump interconnects and prevents delamination of the underfill between the components.
Potential Applications
The technology can be applied in various electronic devices and systems where bump interconnects are used to pass signals and power between components.
Problems Solved
1. Reduction of shorts between bump interconnects. 2. Prevention of underfill delamination.
Benefits
1. Improved reliability of circuit packages. 2. Enhanced performance of electronic devices. 3. Cost-effective solution for preventing interconnect issues.
Potential Commercial Applications
Optimizing circuit packages in consumer electronics, automotive systems, medical devices, and telecommunications equipment.
Possible Prior Art
Previous methods for reducing shorts and preventing delamination in circuit packages may include using different materials or coatings on the interconnects.
Unanswered Questions
How does the polymer layer adhere to the bump interconnects and prevent shorts?
The abstract does not provide specific details on the adhesion mechanism of the polymer layer to the bump interconnects.
What is the expected lifespan of the polymer layer in this application?
The abstract does not mention the durability or longevity of the polymer layer in the circuit package.
Original Abstract Submitted
circuit packages with a polymer layer around the bump interconnects have a reduced number of shorts between the bump interconnects and have reduced underfill delamination. the circuit package includes a first component coupled to a second component through a plurality of bump interconnects employed for passing logic signals, data signals, and/or power. the bump interconnects extend from a surface of the first component and are coupled to contact pads on an opposing surface of the second component. the side surfaces of the bump interconnects extend in a direction from the second component to the first. the circuit package includes the polymer layer disposed on the surface of the first component around the bump interconnects and on the side surfaces of the bump interconnects. the polymer layer reduces shorts between the side surfaces of adjacent bump interconnects and reduces delamination of an underfill disposed between the first and second components.
