Samsung electronics co., ltd. (20240096728). SEMICONDUCTOR PACKAGES simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGES
Organization Name
Inventor(s)
Jin Kyeong Seol of Suwon-si (KR)
Hyuek Jae Lee of Suwon-si (KR)
SEMICONDUCTOR PACKAGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096728 titled 'SEMICONDUCTOR PACKAGES
Simplified Explanation
The semiconductor package described in the abstract includes a first semiconductor die with memory, a second semiconductor die with memory, a dummy die without memory, a heat sink with a metal material, and a mold film on the side surfaces of each die and the heat sink. The heat sink has a decreasing width away from the top surface of the dummy die and curved side surfaces.
- Explanation of the patent/innovation:
* Semiconductor package with multiple dies and a heat sink * Dummy die without memory for heat dissipation * Heat sink with metal material and curved side surfaces * Mold film for protection and insulation
Potential Applications
The technology described in the patent could be applied in:
- High-performance computing devices
- Data centers
- Automotive electronics
Problems Solved
This technology helps in:
- Improving thermal management in semiconductor devices
- Enhancing memory performance
- Increasing overall device reliability
Benefits
The benefits of this technology include:
- Better heat dissipation
- Improved memory functionality
- Enhanced device longevity
Potential Commercial Applications
The semiconductor package innovation could be used in:
- Mobile devices
- Gaming consoles
- IoT devices
Possible Prior Art
One possible prior art could be the use of heat sinks in semiconductor packages for thermal management. Another could be the integration of multiple dies in a single package for increased functionality.
Unanswered Questions
How does the technology impact the overall size of the semiconductor package?
The abstract does not provide information on whether the addition of the heat sink and dummy die affects the size of the package.
What materials are used in the mold film for protection?
The abstract mentions a mold film on the side surfaces of the dies and heat sink, but does not specify the materials used in the film.
Original Abstract Submitted
a semiconductor package is provided. the semiconductor package comprises a first semiconductor die including a memory, a second semiconductor die including a memory and on the first semiconductor die, a dummy die on the semiconductor device and not including a memory, a heat sink on the dummy die and including a metal material and a mold film on side surfaces of each of the first semiconductor die, the second semiconductor die, the dummy die, and the heat sink. a width of the heat sink may decrease away from a top surface of the dummy die, and side surfaces of the heat sink may be curved.
