International business machines corporation (20240113055). STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS simplified abstract

STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS

Organization Name

international business machines corporation

Inventor(s)

Nicholas Alexander Polomoff of Hopewell Junction NY (US)

Eric Perfecto of North Salem NY (US)

Katsuyuki Sakuma of Fishkill NY (US)

Mukta Ghate Farooq of Hopewell Junction NY (US)

Spyridon Skordas of Troy NY (US)

Sathyanarayanan Raghavan of Ballston Lake NY (US)

Michael P. Belyansky of Halfmoon NY (US)

STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240113055 titled 'STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS

Simplified Explanation

The abstract describes a hybrid bonded semiconductor structure with voids aligned to form a unified void with airgaps across the hybrid bond interface.

• The structure includes two substrates joined in a hybrid bond, each with a die portion and a crackstop structure.
• Void formations in the substrates around the crackstop structures align to create a unified void with airgaps.
• The voids and airgaps enhance the performance and reliability of the semiconductor structure.

Potential Applications

The technology could be applied in:

• Semiconductor manufacturing
• Electronics industry
• Microchip production

Problems Solved

This technology addresses issues such as:

• Improving bond strength in semiconductor structures
• Enhancing reliability and performance of electronic devices
• Minimizing cracks and defects in semiconductor materials

Benefits

The benefits of this technology include:

• Increased durability and longevity of semiconductor devices
• Enhanced electrical performance
• Improved overall quality of electronic products

Potential Commercial Applications

The technology could be commercially applied in:

• Semiconductor fabrication companies
• Electronics manufacturers
• Research and development labs

Possible Prior Art

One possible prior art could be the use of voids and airgaps in semiconductor structures to improve performance and reliability. However, the specific alignment of voids across a hybrid bond interface as described in this patent application may be a novel innovation.

How does the alignment of voids and airgaps impact the overall performance of the semiconductor structure?

The alignment of voids and airgaps is crucial in enhancing the reliability and durability of the semiconductor structure by reducing stress concentrations and improving thermal management.

What are the potential challenges in manufacturing semiconductor structures with aligned voids and airgaps?

Some potential challenges in manufacturing could include precise alignment of voids, controlling the size and distribution of airgaps, and ensuring the structural integrity of the semiconductor device during the bonding process.

Original Abstract Submitted

a hybrid bonded semiconductor structure includes a first substrate and a second substrate each having an interface joined in a hybrid bond. each substrate has a die portion and a crackstop structure adjacent the die portion. one or more voids in the first substrate and the second substrate are formed in or about a portion of a periphery of each crackstop structure. at least some of the one or more voids in the first substrate and the second substrate are substantially aligned to form a unified void with airgaps across the hybrid bond interface.