Intel corporation (20240106139). CONNECTOR TO ELECTRICALLY COUPLE MULTIPLE SUBSTRATES simplified abstract
Contents
- 1 CONNECTOR TO ELECTRICALLY COUPLE MULTIPLE SUBSTRATES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CONNECTOR TO ELECTRICALLY COUPLE MULTIPLE SUBSTRATES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
CONNECTOR TO ELECTRICALLY COUPLE MULTIPLE SUBSTRATES
Organization Name
Inventor(s)
Eng Huat Goh of Ayer Itam (MY)
Chin Mian Choong of Georgetown (MY)
Jooi Wah Wong of Bukit Mertajam (MY)
CONNECTOR TO ELECTRICALLY COUPLE MULTIPLE SUBSTRATES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240106139 titled 'CONNECTOR TO ELECTRICALLY COUPLE MULTIPLE SUBSTRATES
Simplified Explanation
The abstract describes a patent application for a connector for a modular memory package that directly electrically couples memory dies on one substrate to a compute die on another substrate.
- The connector includes a first plurality of leads that are parallel with each other, and a second plurality of leads that are parallel with each other and electrically couple the two substrates.
- The connector allows for efficient electrical coupling between memory dies and a compute die in a modular memory package.
Potential Applications
This technology could be applied in the development of high-performance computing systems, data centers, and other electronic devices requiring efficient memory and compute integration.
Problems Solved
This technology solves the problem of efficiently connecting memory dies to a compute die in a modular memory package, improving overall system performance and reliability.
Benefits
The benefits of this technology include improved data transfer speeds, reduced latency, and increased overall system efficiency in electronic devices.
Potential Commercial Applications
This technology could be commercially applied in the development of advanced computer systems, servers, and other electronic devices requiring high-speed memory and compute integration.
Possible Prior Art
One possible prior art could be the use of traditional connectors or interposers to connect memory dies to compute dies in electronic devices. However, the direct electrical coupling described in this patent application offers a more efficient and compact solution.
Unanswered Questions
How does this technology compare to existing memory and compute integration solutions in terms of cost-effectiveness?
This article does not provide information on the cost-effectiveness of this technology compared to existing solutions.
What are the potential challenges or limitations of implementing this technology in practical electronic devices?
This article does not address any potential challenges or limitations that may arise when implementing this technology in real-world applications.
Original Abstract Submitted
embodiments herein relate to systems, apparatuses, or processes for a connector for a modular memory package that includes one or more memory dies on a substrate, where the connector directly electrically couples electrical contacts at an edge and on each side the substrate of the memory package to electrical contacts at an edge and on each side of another substrate that includes a compute die. the connector may include a first plurality of leads that are substantially parallel with each other, and a second plurality of leads that are substantially parallel with each other that are below the first plurality of leads and electrically couple the two substrates. other embodiments may be described and/or claimed.
