International business machines corporation (20240096783). FLEXIBLE WIRING ARCHITECTURE FOR MULTI-DIE INTEGRATION simplified abstract
Contents
- 1 FLEXIBLE WIRING ARCHITECTURE FOR MULTI-DIE INTEGRATION
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 FLEXIBLE WIRING ARCHITECTURE FOR MULTI-DIE INTEGRATION - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
FLEXIBLE WIRING ARCHITECTURE FOR MULTI-DIE INTEGRATION
Organization Name
international business machines corporation
Inventor(s)
Tao Li of Slingerlands NY (US)
Ruilong Xie of Niskayuna NY (US)
Chih-Chao Yang of Glenmont NY (US)
FLEXIBLE WIRING ARCHITECTURE FOR MULTI-DIE INTEGRATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096783 titled 'FLEXIBLE WIRING ARCHITECTURE FOR MULTI-DIE INTEGRATION
Simplified Explanation
The semiconductor structure described in the patent application includes a power distribution structure, an interconnect structure, and at least one decoupling capacitor connected between the power distribution structure and the interconnect structure.
- The power distribution structure is placed on a first wafer.
- The interconnect structure is located on the first wafer and a second wafer.
- The decoupling capacitor is connected between the power distribution structure and the interconnect structure.
Potential Applications
This technology could be applied in:
- Integrated circuits
- Power management systems
- Electronic devices
Problems Solved
This technology helps in:
- Improving power distribution efficiency
- Reducing noise in semiconductor structures
Benefits
The benefits of this technology include:
- Enhanced performance of semiconductor devices
- Increased reliability of power distribution
- Improved signal integrity
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Semiconductor manufacturing companies
- Electronics industry
- Power management sector
Possible Prior Art
One possible prior art could be the use of decoupling capacitors in semiconductor structures to improve power distribution and reduce noise.
Unanswered Questions
How does this technology impact the overall cost of semiconductor manufacturing?
This article does not address the potential cost implications of implementing this technology in semiconductor manufacturing processes.
What are the environmental implications of using this technology in electronic devices?
The environmental impact of using decoupling capacitors in electronic devices is not discussed in this article.
Original Abstract Submitted
a semiconductor structure includes a power distribution structure disposed on a first wafer, an interconnect structure disposed on the first wafer and a second wafer, and at least one decoupling capacitor connected between the power distribution structure and the interconnect structure.
