There is currently no text in this page. You can search for this page title in other pages, or search the related logs, but you do not have permission to create this page.
Category:Applied materials, inc.
Subcategories
This category has the following 200 subcategories, out of 819 total.
(previous page) (next page)A
B
C
D
E
F
Pages in category "Applied materials, inc."
The following 200 pages are in this category, out of 533 total.
(previous page) (next page)A
- Applied materials, inc. (20240247113). METHOD OF FORMING AN AQUEOUS POLYMER COMPOSITION simplified abstract
- Applied materials, inc. (20240247362). NOZZLE FOR A DISTRIBUTOR OF A MATERIAL DEPOSITION SOURCE, MATERIAL DEPOSITION SOURCE, VACUUM DEPOSITION SYSTEM AND METHOD FOR DEPOSITING MATERIAL simplified abstract
- Applied materials, inc. (20240247365). MULTICATHODE PVD SYSTEM FOR HIGH ASPECT RATIO BARRIER SEED DEPOSITION simplified abstract
- Applied materials, inc. (20240247370). ATOMIC LAYER DEPOSITION OF RUTHENIUM OXIDE COATINGS simplified abstract
- Applied materials, inc. (20240247371). SEMICONDUCTOR PROCESSING CHAMBERS AND METHODS FOR CLEANING THE SAME simplified abstract
- Applied materials, inc. (20240247373). ADJUSTABLE CROSS-FLOW PROCESS CHAMBER LID simplified abstract
- Applied materials, inc. (20240247374). PRECURSOR DELIVERY SYSTEM FOR SEMICONDUCTOR DEVICE FORMATION simplified abstract
- Applied materials, inc. (20240247376). Fluorinated Aluminum Coated Component for a Substrate Processing Apparatus and Method of Producing simplified abstract
- Applied materials, inc. (20240247379). FORMATION OF METALLIC FILMS ON ELECTROLESS METAL PLATING OF SURFACES simplified abstract
- Applied materials, inc. (20240247404). PRE-HEAT RINGS AND PROCESSING CHAMBERS INCLUDING BLACK QUARTZ, AND RELATED METHODS simplified abstract
- Applied materials, inc. (20240247405). METHOD FOR CONTROLLING LAYER-TO-LAYER THICKNESS IN MULTI-TIER EPITAXIAL PROCESS simplified abstract
- Applied materials, inc. (20240247407). INDIUM-GALLIUM-NITRIDE LIGHT EMITTING DIODES WITH INCREASED QUANTUM EFFICIENCY simplified abstract
- Applied materials, inc. (20240248046). MULTI-HEAD OPTICAL INSPECTION SYSTEMS AND TECHNIQUES FOR SEMICONDUCTOR MANUFACTURING simplified abstract
- Applied materials, inc. (20240248282). APPARATUS AND METHODS FOR HEATING TUNABILITY IN PROCESSING CHAMBERS simplified abstract
- Applied materials, inc. (20240248297). APPARATUS AND METHODS FOR HEATING TUNABILITY IN PROCESSING CHAMBERS simplified abstract
- Applied materials, inc. (20240248298). APPARATUS AND METHODS FOR HEATING TUNABILITY IN PROCESSING CHAMBERS simplified abstract
- Applied materials, inc. (20240248339). FLEXIBLE MULTI-LAYERED COVER LENS STACKS FOR FOLDABLE DISPLAYS simplified abstract
- Applied materials, inc. (20240248466). PROCESS CHAMBER QUALIFICATION FOR MAINTENANCE PROCESS ENDPOINT DETECTION simplified abstract
- Applied materials, inc. (20240249052). SYSTEMS AND METHODS FOR PREDICTING FILM THICKNESS USING VIRTUAL METROLOGY simplified abstract
- Applied materials, inc. (20240249062). OVERLAYING ON LOCALLY DISPOSITIONED PATTERNS BY ML BASED DYNAMIC DIGITAL CORRECTIONS (ML-DDC) simplified abstract
- Applied materials, inc. (20240249904). Ion Source For Controlling Decomposition Buildup Using Chlorine Co-Gas simplified abstract
- Applied materials, inc. (20240249908). Dose Cup Assembly for an Ion Implanter simplified abstract
- Applied materials, inc. (20240249915). PLASMA EXCITATION WITH ION ENERGY CONTROL simplified abstract
- Applied materials, inc. (20240249918). Processing Chamber With Multiple Plasma Units simplified abstract
- Applied materials, inc. (20240249920). REMOVABLE MASK LAYER TO REDUCE OVERHANG DURING RE-SPUTTER PROCESS IN PVD CHAMBERS simplified abstract
- Applied materials, inc. (20240249924). BIPOLAR ELECTROSTATIC CHUCK ELECTRODE DESIGNS simplified abstract
- Applied materials, inc. (20240249934). INTEGRATED METHOD AND TOOL FOR HIGH QUALITY SELECTIVE SILICON NITRIDE DEPOSITION simplified abstract
- Applied materials, inc. (20240249936). METHODS FOR REDUCING MICRO AND MACRO SCALLOPING ON SEMICONDUCTOR DEVICES simplified abstract
- Applied materials, inc. (20240249953). DRY ETCH OF BORON-CONTAINING MATERIAL simplified abstract
- Applied materials, inc. (20240249965). SUBSTRATE SUPPORT CARRIER HAVING MULTIPLE CERAMIC DISCS simplified abstract
- Applied materials, inc. (20240251546). DRAM Transistor Including Pillars Formed Using Low-Temperature Ion Implant simplified abstract
- Applied materials, inc. (20240253179). POLISHING HEAD WITH LOCAL WAFER PRESSURE simplified abstract
- Applied materials, inc. (20240253183). APPARATUS AND METHOD FOR CONTROLLING SUBSTRATE POLISH EDGE UNIFORMITY simplified abstract
- Applied materials, inc. (20240253968). LIQUID LITHIUM SUPPLY AND REGULATION simplified abstract
- Applied materials, inc. (20240254624). PLATE ASSEMBLIES, PROCESS KITS, AND PROCESSING CHAMBERS FOR SEMICONDUCTOR MANUFACTURING simplified abstract
- Applied materials, inc. (20240254627). INJECTORS, LINERS, PROCESS KITS, PROCESSING CHAMBERS, AND RELATED METHODS FOR GAS FLOW IN BATCH PROCESSING OF SEMICONDUCTOR MANUFACTURING simplified abstract
- Applied materials, inc. (20240254645). LOW TEMPERATURE HYBRID BONDING METALLIZATION simplified abstract
- Applied materials, inc. (20240254653). CELL ARCHITECTURAL STRUCTURES FOR ENHANCED THERMAL MANAGEMENT IN EPITAXIAL GROWTH PROCESSING CHAMBER simplified abstract
- Applied materials, inc. (20240254654). EPI ISOLATION PLATE WITH GAP AND ANGLE ADJUSTMENT FOR PROCESS TUNING simplified abstract
- Applied materials, inc. (20240254655). EPI ISOLATION PLATE AND PARALLEL BLOCK PURGE FLOW TUNING FOR GROWTH RATE AND UNIFORMITY simplified abstract
- Applied materials, inc. (20240255700). SURFACE ROUGHNESS REDUCTION FOR PHOTONICS USING HIGH-TEMPERATURE IMPLANTATION simplified abstract
- Applied materials, inc. (20240258070). PLASMA UNIFORMITY CONTROL SYSTEM AND METHODS simplified abstract
- Applied materials, inc. (20240258075). SUBSTRATE SUPPORT WITH REAL TIME FORCE AND FILM STRESS CONTROL simplified abstract
- Applied materials, inc. (20240258076). SPRAY-COATED ELECTROSTATIC CHUCK DESIGN simplified abstract
- Applied materials, inc. (20240258097). PURGE SYSTEM TO CLEAN WAFER BACKSIDE FOR RING SUSCEPTOR simplified abstract
- Applied materials, inc. (20240258103). PLASMA TREATMENT OF BARRIER AND LINER LAYERS simplified abstract
- Applied materials, inc. (20240258106). SUBSTRATE PROCESSING FOR AlN AND GaN POLARITY CONTROL simplified abstract
- Applied materials, inc. (20240258109). METHOD OF DEPOSITING A TUNGSTEN CONTAINING LAYER simplified abstract
- Applied materials, inc. (20240258116). SYSTEMS AND METHODS FOR TITANIUM-CONTAINING FILM REMOVAL simplified abstract
- Applied materials, inc. (20240258136). SUBSTRATE PROCESSING MODULE AND METHOD OF MOVING A WORKPIECE simplified abstract
- Applied materials, inc. (20240258137). SEMICONDUCTOR PROCESSING TOOL PLATFORM CONFIGURATION WITH REDUCED FOOTPRINT simplified abstract
- Applied materials, inc. (20240258140). METHODS AND SYSTEMS FOR TEMPERATURE CONTROL FOR A SUBSTRATE simplified abstract
- Applied materials, inc. (20240258141). METHODS AND APPARATUS FOR CALIBRATION OF SUBSTRATE PROCESSING CHAMBER PLACEMENT VIA IMAGING simplified abstract
- Applied materials, inc. (20240258153). APPARATUS AND METHODS FOR SEMICONDUCTOR PROCESSING simplified abstract
- Applied materials, inc. (20240258161). METHODS OF FORMING INTERCONNECT STRUCTURES simplified abstract
- Applied materials, inc. (20240258164). METHODS OF FORMING INTERCONNECT STRUCTURES simplified abstract
- Applied materials, inc. (20240258375). SILICON CARBIDE TRANSISTOR WITH CHANNEL COUNTER-DOPING AND POCKET-DOPING simplified abstract
- Applied materials, inc. (20240258940). Electrostatic Chuck Having Extended Lifetime simplified abstract
- Applied materials, inc. (20240263299). MODULE FOR FLIPPING SUBSTRATES IN VACUUM simplified abstract
- Applied materials, inc. (20240264336). NON-LINE-OF-SIGHT DEPOSITION OF COATING ON INTERNAL COMPONENTS OF ASSEMBLED DEVICE simplified abstract
- Applied materials, inc. (20240266146). PLASMA PROCESSING IMPROVEMENT simplified abstract
- Applied materials, inc. (20240266152). PLASMA UNIFORMITY CONTROL SYSTEM AND METHODS simplified abstract
- Applied materials, inc. (20240266163). TREATMENTS TO ENHANCE MATERIAL STRUCTURES simplified abstract
- Applied materials, inc. (20240266171). BORON CONCENTRATION TUNABILITY IN BORON-SILICON FILMS simplified abstract
- Applied materials, inc. (20240266174). MITIGATION OF SADDLE DEFORMATION OF SUBSTRATES USING FILM DEPOSITION AND EDGE ION IMPLANTATION simplified abstract
- Applied materials, inc. (20240266175). CARBON AND BORON IMPLANTATION FOR BACKSIDE CHEMICAL MECHANICAL PLANARIZATION CONTROL simplified abstract
- Applied materials, inc. (20240266180). ENHANCED ETCH SELECTIVITY USING HALIDES simplified abstract
- Applied materials, inc. (20240266185). SELECTIVE ETCHING OF SILICON-CONTAINING MATERIAL RELATIVE TO METAL-DOPED BORON FILMS simplified abstract
- Applied materials, inc. (20240266186). STRESS MANAGEMENT FOR PRECISE SUBSTRATE -TO- SUBSTRATE BONDING simplified abstract
- Applied materials, inc. (20240266200). Electrostatic Chuck simplified abstract
- Applied materials, inc. (20240266206). LIFT PIN ASSEMBLY simplified abstract
- Applied materials, inc. (20240266215). LOW STRESS TUNGSTEN LAYER DEPOSITION simplified abstract
- Applied materials, inc. (20240266220). INTEGRATED LASER AND PLASMA ETCH DICING simplified abstract
- Applied materials, inc. (20240266230). OPTIMIZED FILM DEPOSITION AND ION IMPLANTATION FOR MITIGATION OF STRESS AND DEFORMATION IN SUBSTRATES simplified abstract
- Applied materials, inc. (20240266231). CYLINDRIC DECOMPOSITION FOR EFFICIENT MITIGATION OF SUBSTRATE DEFORMATION WITH FILM DEPOSITION AND ION IMPLANTATION simplified abstract
- Applied materials, inc. (20240266233). INFLUENCE FUNCTION-BASED MITIGATION OF SUBSTRATE DEFORMATION WITH FILM DEPOSITION AND ION IMPLANTATION simplified abstract
- Applied materials, inc. (20240266319). Method of Multi-layer Die Stacking with Die-to-Wafer Bonding simplified abstract
- Applied materials, inc. (20240266414). MULTI-VT INTEGRATION SCHEME FOR SEMICONDUCTOR DEVICES simplified abstract
- Applied materials, inc. (20240268095). 4F2 DRAM Including Buried Bitline simplified abstract
- Applied materials, inc. (20240268108). V-NAND STACKS WITH DIPOLE REGIONS simplified abstract
- Applied materials, inc. (20240268205). OLED STRUCTURE AND PROCESS BASED ON PIXEL PASSIVATION BY REMOVING OLED STACK OVER HEAT ABSORBENT STRUCTURES simplified abstract
- Applied materials, inc. (20240279804). MOLYBDENUM(0) PRECURSORS FOR DEPOSITION OF MOLYBDENUM FILMS simplified abstract
- Applied materials, inc. (20240280911). DIGITAL LITHOGRAPHY EXPOSURE UNIT BOUNDARY SMOOTHING simplified abstract
- Applied materials, inc. (20240280913). SYSTEM, SOFTWARE APPLICATION, AND METHOD FOR DOSE UNIFORMITY IMPROVEMENT simplified abstract
- Applied materials, inc. (20240281584). PHYSICAL LAYOUT SYNTHESIS FOR STANDARD CELLS USING SLICE LAYOUTS simplified abstract
- Applied materials, inc. (20240282554). MODULAR HIGH-FREQUENCY SOURCE simplified abstract
- Applied materials, inc. (20240282556). FAST RESPONSE PEDESTAL ASSEMBLY FOR SELECTIVE PRECLEAN simplified abstract
- Applied materials, inc. (20240282558). PHYSICAL VAPOR DEPOSITION SOURCE AND CHAMBER ASSEMBLY simplified abstract
- Applied materials, inc. (20240282585). TREATMENTS TO IMPROVE ETCHED SILICON-AND-GERMANIUM-CONTAINING MATERIAL SURFACE ROUGHNESS simplified abstract
- Applied materials, inc. (20240282601). METHODS OF SELECTIVE OXIDATION ON RAPID THERMAL PROCESSING (RTP) CHAMBER WITH ACTIVE STEAM GENERATION simplified abstract
- Applied materials, inc. (20240282605). LOUVER DESIGN FOR ELIMINATING LINE OF SIGHT simplified abstract
- Applied materials, inc. (20240282631). INTEGRATION SOLUTION FOR NAND DEEP CONTACT GAP FILL simplified abstract
- Applied materials, inc. (20240282632). ELECTRONIC DEVICE FABRICATION USING AREA-SELECTIVE DEPOSITION simplified abstract
- Applied materials, inc. (20240282709). Layered Substrate with Ruthenium Layer and Method for Producing simplified abstract
- Applied materials, inc. (20240282809). SILICON SUPER JUNCTION STRUCTURES FOR INCREASED VOLTAGE simplified abstract
- Applied materials, inc. (20240282813). SILICON SUPER JUNCTION STRUCTURES FOR INCREASED THROUGHPUT simplified abstract
- Applied materials, inc. (20240284650). ULTRATHIN CONFORMAL COATINGS FOR ELECTROSTATIC DISSIPATION IN SEMICONDUCTOR PROCESS TOOLS simplified abstract
- Applied materials, inc. (20240284703). POLARIZER-FREE LED DISPLAYS simplified abstract
- Applied materials, inc. (20240301546). SPUTTER DEPOSITION SOURCE, MAGNETRON SPUTTER CATHODE, AND METHOD OF DEPOSITING A MATERIAL ON A SUBSTRATE simplified abstract
- Applied materials, inc. (20240301549). METAL ORGANONITRILE PRECURSORS FOR THIN FILM DEPOSITION simplified abstract
- Applied materials, inc. (20240301552). ULTRA HIGH-K HAFNIUM OXIDE AND HAFNIUM ZIRCONIUM OXIDE FILMS simplified abstract
- Applied materials, inc. (20240301584). METHOD AND APPARATUS FOR PRECLEANING A SUBSTRATE SURFACE PRIOR TO EPITAXIAL GROWTH simplified abstract
- Applied materials, inc. (20240302812). FABRICATION TOOL CALIBRATION simplified abstract
- Applied materials, inc. (20240304422). PLASMA PROCESSING WITH INDEPENDENT TEMPERATURE CONTROL simplified abstract
- Applied materials, inc. (20240304423). SEMICONDUCTOR CHAMBER COMPONENTS WITH ADVANCED COATING TECHNIQUES simplified abstract
- Applied materials, inc. (20240304429). Novel arc management algorithm of RF generator and match box for CCP plasma chambers simplified abstract
- Applied materials, inc. (20240304430). REAL-TIME DETECTION OF PARTICULATE MATTER DURING DEPOSITION CHAMBER MANUFACTURING simplified abstract
- Applied materials, inc. (20240304437). PECVD OF SIBN THIN FILMS WITH LOW LEAKAGE CURRENT simplified abstract
- Applied materials, inc. (20240304470). HEATER ASSEMBLY WITH PROCESS GAP CONTROL FOR BATCH PROCESSING CHAMBERS simplified abstract
- Applied materials, inc. (20240304478). METHODS AND SYSTEMS FOR TEMPERATURE CONTROL FOR A SUBSTRATE simplified abstract
- Applied materials, inc. (20240304486). DIFFERENTIAL SUBSTRATE BACKSIDE COOLING simplified abstract
- Applied materials, inc. (20240304492). BACK SIDE DESIGN FOR FLAT SILICON CARBIDE SUSCEPTOR simplified abstract
- Applied materials, inc. (20240304495). HYDROGEN PLASMA TREATMENT FOR FORMING LOGIC DEVICES simplified abstract
- Applied materials, inc. (20240304671). Methods For Forming Gate Structures simplified abstract
- Applied materials, inc. (20240306262). Lamp Housing Braze Improvement for Semiconductor Rapid Thermal Processing (RTP) Chamber simplified abstract
- Applied materials, inc. (20240306391). CONTACT CONSTRUCTION FOR SEMICONDUCTOR DEVICES WITH LOW-DIMENSIONAL MATERIALS simplified abstract
- Applied materials, inc. (20240337020). GAS INJECTOR FOR EPITAXY AND CVD CHAMBER simplified abstract
- Applied materials, inc. (20240337040). PLATING SEAL WITH IMPROVED SURFACE simplified abstract
- Applied materials, inc. (20240337318). HIGH TEMPERATURE METAL SEALS FOR VACUUM SEGREGATION simplified abstract
- Applied materials, inc. (20240337449). REGENERATOR FOR FORELINE HEATING simplified abstract
- Applied materials, inc. (20240337537). SYSTEMS, APPARATUS, AND METHODS FOR MONITORING PLATE TEMPERATURE FOR SEMICONDUCTOR MANUFACTURING simplified abstract
- Applied materials, inc. (20240337789). SLAB WAVEGUIDE LAYER FOR ENHANCED NEAR-EYE-DISPLAY SURFACE RELIEF GRATING LIGHTGUIDE simplified abstract
- Applied materials, inc. (20240339287). APPARATUS, SYSTEM AND TECHNIQUES FOR MASS ANALYZED ION BEAM simplified abstract
- Applied materials, inc. (20240339288). HYBRID APPARATUS, SYSTEM AND TECHNIQUES FOR MASS ANALYZED ION BEAM simplified abstract
- Applied materials, inc. (20240339301). CCP GAS DELIVERY NOZZLE simplified abstract
- Applied materials, inc. (20240339302). ELECTRICAL BREAK FOR SUBSTRATE PROCESSING SYSTEMS simplified abstract
- Applied materials, inc. (20240339316). PROCESSES FOR DEPOSITING SIB FILMS simplified abstract
- Applied materials, inc. (20240339318). SEGMENTED FORMATION OF GATE INTERFACE simplified abstract
- Applied materials, inc. (20240339324). Atmospheric Pressure Plasma for Substrate Annealing simplified abstract
- Applied materials, inc. (20240339341). AUTOMATIC CONTROL OF SUBSTRATES simplified abstract
- Applied materials, inc. (20240339342). EPI CHAMBER WITH FULL WAFER LASER HEATING simplified abstract
- Applied materials, inc. (20240339347). INTEGRATED SUBSTRATE MEASUREMENT SYSTEM simplified abstract
- Applied materials, inc. (20240339349). ADVANCED METHOD FOR CREATING ELECTROSTATIC CHUCK (ESC) MESA PATTERNS simplified abstract
- Applied materials, inc. (20240339352). SUSCEPTOR FOR PROCESS CHAMBER simplified abstract
- Applied materials, inc. (20240339358). METHOD OF FORMING A METAL LINER FOR INTERCONNECT STRUCTURES simplified abstract
- Applied materials, inc. (20240341082). 4F2 VERTICAL ACCESS TRANSISTOR WITH REDUCED FLOATING BODY EFFECT simplified abstract
- Applied materials, inc. (20240341090). DYNAMIC RANDOM ACCESS MEMORY (DRAM) STORAGE NODE CONTACT simplified abstract
- Applied materials, inc. (20240341125). CONDUCTIVE OXIDE OVERHANG STRUCTURES FOR OLED DEVICES simplified abstract
- Applied materials, inc. (20240341127). HIGH RESOLUTION ADVANCED OLED SUB-PIXEL CIRCUIT AND PATTERNING METHOD simplified abstract
- Applied materials, inc. (20240408621). SHOWERHEAD HEATED BY CIRCULAR ARRAY
- Applied materials, inc. (20240408650). METHOD AND APPARATUS TO CLEAN SUBSTRATE WITH ATOMIZING NOZZLE
- Applied materials, inc. (20240408712). CERAMIC COOLING BASE
- Applied materials, inc. (20240409350). VACUUM PROCESSING SYSTEM, APPARATUS AND METHOD FOR TRANSPORTING A THIN FILM SUBSTRATE
- Applied materials, inc. (20240409449). LASER DICING GLASS WAFERS USING ADVANCED LASER SOURCES
- Applied materials, inc. (20240410078). IN-SITU FILM GROWTH RATE MONITORING APPARATUS, SYSTEMS, AND METHODS FOR SUBSTRATE PROCESSING
- Applied materials, inc. (20240410773). Integrated Pressure Sensor for Process Chamber Assemblies
- Applied materials, inc. (20240411085). SELECTIVE WAVEGUIDE ION IMPLANTATION TO ADJUST LOCAL REFRACTIVE INDEX FOR PHOTONICS
- Applied materials, inc. (20240412020). Method and System for Scanning a Code on a Transparent Part
- Applied materials, inc. (20240412899). SELF-CENTERING VOLTAGE STANDOFF
- Applied materials, inc. (20240412947). RADIO-FREQUENCY (RF) MATCHING NETWORK FOR FAST IMPEDANCE TUNING
- Applied materials, inc. (20240412948). METHODS AND APPARATUS FOR RPS-RF PLASMA CLEAN AND ACTIVATION FOR ADVANCED SEMICONDUCTOR PACKAGING
- Applied materials, inc. (20240412954). PROCESS CHAMBERS HAVING MULTIPLE COOLING PLATES
- Applied materials, inc. (20240412956). ION EXTRACTION OPTICS HAVING NON UNIFORM GRID ASSEMBLY
- Applied materials, inc. (20240412957). HIGH TEMPERATURE BIASABLE HEATER WITH ADVANCED FAR EDGE ELECTRODE, ELECTROSTATIC CHUCK, AND EMBEDDED GROUND ELECTRODE
- Applied materials, inc. (20240412959). PRINTED MICROWAVE RESONATOR FOR MEASURING HIGH ELECTRON DENSITY PLASMAS
- Applied materials, inc. (20240412985). DEDICATED SULFURIC-PEROXIDE PROCESS MODULE FOR POST-CMP CLEANING PLATFORMS
- Applied materials, inc. (20240412997). HIGH-PRECISION IN-SITU VERIFICATION AND CORRECTION OF WAFER POSITION AND ORIENTATION FOR ION IMPLANT
- Applied materials, inc. (20240413011). AUTOMATED DIAL-IN OF ELECTROPLATING PROCESS PARAMETERS BASED ON WAFER RESULTS FROM EX-SITU METROLOGY
- Applied materials, inc. (20240416514). CALIBRATION SYSTEM
- Applied materials, inc. (20240417266). PROCESS FOR MANUFACTURING A SILICON CARBIDE COATED BODY
- Applied materials, inc. (20240418992). LARGE-FIELD-OF-VIEW SINGLE-SHEET WAVEGUIDE COMBINERS
- Applied materials, inc. (20240419081). METHOD TO REDUCE DEFECTS POST-SEQUENTIAL INFILTRATION SYNTHESIS
- Applied materials, inc. (20240419151). COMMUNICATION NODE TO INTERFACE BETWEEN EVALUATION SYSTEMS AND A MANUFACTURING SYSTEM
- Applied materials, inc. (20240419813). METHODS AND MECHANISMS FOR SECURE DATA SHARING
- Applied materials, inc. (20240420919). METHOD OF ASSEMBLING DRIFT TUBE ASSEMBLIES IN ION IMPLANTORS
- Applied materials, inc. (20240420920). INTEGRATED GAS BOX AND ION SOURCE
- Applied materials, inc. (20240420921). IMMERSED PLASMA SOURCE AND PROCESS CHAMBER FOR LARGE AREA SUBSTRATES
- Applied materials, inc. (20240420924). SEMICONDUCTOR MANUFACTURING PROCESS CHAMBER COOLING FLANGE FOR REMOTE PLASMA SOURCE SUPPLY
- Applied materials, inc. (20240420926). ATOMIC LAYER DEPOSITION PART COATING CHAMBER
- Applied materials, inc. (20240420932). SUBSTRATE SUPPORT
- Applied materials, inc. (20240420933). RESISTIVITY-CONTROLLED DIELECTRIC MATERIALS FOR SUBSTRATE SUPPORTS WITH IMPROVED HIGH TEMPERATURE CHUCKING
- Applied materials, inc. (20240420934). IN-SITU ETCH AND INHIBITION IN PLASMA ENHANCED ATOMIC LAYER DEPOSITION
- Applied materials, inc. (20240420937). GROUNDING DEVICE FOR THIN FILM FORMATION USING PLASMA
- Applied materials, inc. (20240420947). METAL OXIDE PRECLEAN FOR BOTTOM-UP GAPFILL IN MEOL AND BEOL
- Applied materials, inc. (20240420948). SELECTIVE CARBON DEPOSITION ON TOP AND BOTTOM SURFACES OF SEMICONDUCTOR SUBSTRATES
- Applied materials, inc. (20240420949). DOPED SILICON OXIDE FOR BOTTOM-UP DEPOSITION
- Applied materials, inc. (20240420950). DENSIFIED SEAM-FREE SILICON-CONTAINING MATERIAL GAP FILL PROCESSES
- Applied materials, inc. (20240420952). NESTED-LOOP PLASMA ENHANCED ATOMIC LAYER DEPOSITION
- Applied materials, inc. (20240420953). SYSTEMS AND METHODS FOR IMPROVING MECHANICAL STRENGTH OF LOW DIELECTRIC CONSTANT MATERIALS
- Applied materials, inc. (20240420962). METHODS OF SELECTIVELY ETCHING SILICON NITRIDE
- Applied materials, inc. (20240420966). COPPER REFLOW BY SURFACE MODIFICATION
- Applied materials, inc. (20240420975). LOW OPEN AREA AND COUPON ENDPOINT DETECTION
- Applied materials, inc. (20240420981). SUBSTRATE TRANSFER SYSTEMS AND METHODS OF USE THEREOF
- Applied materials, inc. (20240420984). ELECTROSTATIC SUBSTRATE SUPPORT
- Applied materials, inc. (20240420986). FORMING MESAS ON AN ELECTROSTATIC CHUCK
- Applied materials, inc. (20240420996). SELECTIVE SELF-ASSEMBLED MONOLAYER (SAM) REMOVAL
- Applied materials, inc. (20240420997). SELECTIVE LINER DEPOSITION FOR VIA RESISTANCE REDUCTION
- Applied materials, inc. (20240423015). FLEXIBLE COVER LENS FILMS
- Applied materials, inc. (20250001547). FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS
- Applied materials, inc. (20250003061). INTERFACE TUNING FOR EROSION AND CORROSION RESISTANT COATINGS FOR SEMICONDUCTOR COMPONENTS
- Applied materials, inc. (20250003076). MODULAR HEATING JACKET WITH REMOLDABLE INSULATOR
- Applied materials, inc. (20250003112). VIRTUAL SENSOR FOR PREDICTING AND MONITORING TEMPERATURE OF CHAMBER COMPONENTS
- Applied materials, inc. (20250003737). OFF-AXIS MOTION CHARACTERIZATION OF A LINEAR ACTUATOR
- Applied materials, inc. (20250003742). ENHANCED CROSS SECTIONAL FEATURES MEASUREMENT METHODOLOGY
- Applied materials, inc. (20250003806). CHAMBER KITS, SYSTEMS, AND METHODS FOR CALIBRATING TEMPERATURE SENSORS FOR SEMICONDUCTOR MANUFACTURING
- Applied materials, inc. (20250004438). DISTURBANCE COMPENSATION FOR SUBSTRATE PROCESSING RECIPES
- Applied materials, inc. (20250004457). RUN-TO-RUN CONTROL AT A MANUFACTURING SYSTEM USING MACHINE LEARNING
- Applied materials, inc. (20250006465). Remote Plasma Source and Plasma Processing Chamber Having Same
- Applied materials, inc. (20250006474). INTERCONNECT CAPPING WITH INTEGRATED PROCESS STEPS
- Applied materials, inc. (20250006485). SELECTIVE DEPOSITION PROCESSES ON SEMICONDUCTOR SUBSTRATES