Applied materials, inc. (20250006465). Remote Plasma Source and Plasma Processing Chamber Having Same
Remote Plasma Source and Plasma Processing Chamber Having Same
Organization Name
Inventor(s)
Kartik Ramaswamy of San Jose CA US
Fernando Silveira of Livermore CA US
Remote Plasma Source and Plasma Processing Chamber Having Same
This abstract first appeared for US patent application 20250006465 titled 'Remote Plasma Source and Plasma Processing Chamber Having Same
Original Abstract Submitted
methods and apparatus for a point of use remote plasma source are provided. in embodiments, a remote plasma apparatus includes: an enclosure surrounding a cavity; a first conductor surrounding a first portion of the enclosure; a second conductor surrounding a second portion of the enclosure, wherein the first portion of the enclosure and the second portion of the enclosure overlap by an overlap amount, and wherein each of the first conductor and the second conductor are circumferentially discontinuous; a dielectric layer disposed between and separating the first conductor and the second conductor; a gas inlet configured to flow a gas into the cavity; and a gas outlet disposed in a bottom of the enclosure and configured to flow the gas out of the cavity.