Applied materials, inc. (20240258070). PLASMA UNIFORMITY CONTROL SYSTEM AND METHODS simplified abstract
PLASMA UNIFORMITY CONTROL SYSTEM AND METHODS
Organization Name
Inventor(s)
Michael Andrew Stearns of San Jose CA (US)
Kartik Ramaswamy of San Jose CA (US)
Carlaton Wong of Sunnyvale CA (US)
PLASMA UNIFORMITY CONTROL SYSTEM AND METHODS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240258070 titled 'PLASMA UNIFORMITY CONTROL SYSTEM AND METHODS
Abstract: Embodiments of the present disclosure include an apparatus and methods for the plasma processing of a substrate. Some embodiments are directed to a plasma processing chamber. The plasma processing chamber generally includes a planar coil region comprising a plurality of planar coils, a first power supply circuit coupled to at least two of the plurality of planar coils, a concentric coil region at least partially surrounding the planar coil region, and a second power supply circuit coupled to at least two of a plurality of concentric coils. The first power supply circuit may be configured to bias the at least two of the plurality of planar coils to affect a plasma in a center region of the plasma processing chamber, and the second power supply circuit may be configured to bias the at least two of the plurality of concentric coils to affect the plasma in an outer region.
- Simplified Explanation:
This patent application describes an apparatus and methods for plasma processing a substrate using a plasma processing chamber with planar and concentric coil regions.
- Key Features and Innovation:
- Plasma processing chamber with planar coil region and concentric coil region - First power supply circuit biases planar coils for center region plasma control - Second power supply circuit biases concentric coils for outer region plasma control
- Potential Applications:
- Semiconductor manufacturing - Thin film deposition - Surface cleaning and etching processes
- Problems Solved:
- Precise control of plasma distribution - Enhanced substrate processing uniformity - Improved efficiency in plasma processing
- Benefits:
- Higher quality substrate processing - Increased productivity - Cost savings through improved efficiency
- Commercial Applications:
Plasma processing equipment manufacturers can integrate this technology into their systems to offer more precise and efficient plasma processing solutions to various industries, such as semiconductor manufacturing and surface treatment.
- Questions about Plasma Processing Technology:
1. How does the use of planar and concentric coils in the plasma processing chamber improve substrate processing? - The use of planar and concentric coils allows for precise control of plasma distribution, leading to enhanced processing uniformity and efficiency.
2. What are the potential challenges in implementing this technology in industrial-scale plasma processing systems? - Challenges may include scalability, cost-effectiveness, and integration with existing equipment.
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Original Abstract Submitted
embodiments of the present disclosure include an apparatus and methods for the plasma processing of a substrate. some embodiments are directed to a plasma processing chamber. the plasma processing chamber generally includes a planar coil region comprising a plurality of planar coils, a first power supply circuit coupled to at least two of the plurality of planar coils, a concentric coil region at least partially surrounding the planar coil region, and a second power supply circuit coupled to at least two of a plurality of concentric coils. the first power supply circuit may be configured to bias the at least two of the plurality of planar coils to affect a plasma in a center region of the plasma processing chamber, and the second power supply circuit may be configured to bias the at least two of the plurality of concentric coils to affect the plasma in an outer region.