INTEGRATED LASER AND PLASMA ETCH DICING

Organization Name

Inventor(s)

Jonathan Bryant Mellen of Portland OR (US)

INTEGRATED LASER AND PLASMA ETCH DICING - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240266220 titled 'INTEGRATED LASER AND PLASMA ETCH DICING

The patent application describes a method for dicing a die from a substrate for bonding using laser and multiple etch processes.

Laser cutting process is used to form a cut that removes a portion of the dicing street in the substrate.
First plasma etch process increases the laser kerf width and removes non-silicon material from the bottom of the cut.
Second plasma etch process further increases the width to the dicing street width and completely separates the die from the substrate.

Potential Applications: - Semiconductor manufacturing - Electronics industry - Microelectronics production

Problems Solved: - Efficient and precise dicing of dies from substrates - Removal of non-silicon materials - Ensuring clean separation of the die

Benefits: - Improved accuracy and consistency in die dicing - Reduction in material wastage - Enhanced quality control in manufacturing processes

Commercial Applications: Title: Advanced Die Dicing Method for Semiconductor Manufacturing This technology can be used in semiconductor fabrication facilities to enhance the efficiency and precision of die dicing processes, leading to higher quality products and increased productivity in the electronics industry.

Prior Art: Readers can explore prior art related to laser cutting, plasma etching, and die dicing processes in semiconductor manufacturing to understand the evolution of this technology.

Frequently Updated Research: Researchers are continually exploring new methods and materials to further improve the die dicing process and enhance the overall efficiency of semiconductor manufacturing.

Questions about Die Dicing: 1. How does the use of laser cutting improve the precision of die dicing? 2. What are the potential challenges associated with implementing multiple etch processes in die dicing?

Original Abstract Submitted

a method for dicing a die from a substrate for bonding that leverages laser and multiple etch processes. the method may include performing a laser cutting process to form a cut that removes a first portion of a dicing street in the substrate, performing a first plasma etch process to increase the laser kerf width to a first plasma etch width that is less than a dicing street width and to remove any non-silicon material from a bottom of the cut, and performing a second plasma etch process to increase the first plasma etch width to the dicing street width and to remove any remaining portion of the dicing street to completely separate the die from the substrate.