Applied materials, inc. (20240337318). HIGH TEMPERATURE METAL SEALS FOR VACUUM SEGREGATION simplified abstract

HIGH TEMPERATURE METAL SEALS FOR VACUUM SEGREGATION

Organization Name

applied materials, inc.

Inventor(s)

Muhannad Mustafa of Milpitas CA (US)

Sanjeev Baluja of Campbell CA (US)

HIGH TEMPERATURE METAL SEALS FOR VACUUM SEGREGATION - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240337318 titled 'HIGH TEMPERATURE METAL SEALS FOR VACUUM SEGREGATION

The patent application is related to a pressure seal for a process chamber that is designed to reduce pumping time in a processing chamber for semiconductor substrates at high temperatures.

• The pressure seal consists of a bottom portion, a compressible middle portion, and a top portion.
• It is configured to decrease the pumping time of a process region in the chamber compared to chambers without the seal.
• The seal allows processing chambers to operate at temperatures of 350°C or higher.
• Methods for sealing a processing chamber using this pressure seal are also provided.

Potential Applications: - Semiconductor manufacturing processes - High-temperature processing chambers - Vacuum systems in industrial settings

Problems Solved: - Reduced pumping time in processing chambers - Improved efficiency in high-temperature processing - Enhanced sealing capabilities for semiconductor substrates

Benefits: - Faster processing times - Increased productivity in semiconductor manufacturing - Improved reliability in high-temperature environments

Commercial Applications: Title: "High-Temperature Pressure Seal for Semiconductor Processing Chambers" This technology could be used in semiconductor fabrication facilities, research institutions, and industrial settings where high-temperature processing is required. It can improve the efficiency and reliability of semiconductor manufacturing processes.

Questions about the technology: 1. How does the pressure seal contribute to reducing pumping time in the processing chamber? 2. What are the specific advantages of using this pressure seal in high-temperature environments?

Frequently Updated Research: There may be ongoing research in the field of pressure seals for processing chambers, focusing on further enhancing efficiency and reliability in semiconductor manufacturing processes. Researchers may be exploring new materials and designs to optimize the performance of these seals.

Original Abstract Submitted

embodiments of the present disclosure are related to directed to a pressure seal for a process chamber. the pressure seal comprises a bottom portion, a compressible middle portion on the bottom portion, and a top portion on the compressible middle portion. the disclosed pressure seal is configured to reduce pumping time of a process region in an interior volume of a processing chamber compared to a process chamber that does not include a pressure seal. processing chambers including the disclosed pressure seal are configured to process a semiconductor substrate at high temperatures, such as a temperature of greater than or equal to 350� c. methods of sealing a processing chamber using the disclosed pressure seal are also described.