Applied materials, inc. (20250001547). FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS
FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS
Organization Name
Inventor(s)
Kevin H. Song of San Jose CA US
Benedict W. Pang of Burlingame CA US
FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS
This abstract first appeared for US patent application 20250001547 titled 'FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS
Original Abstract Submitted
exemplary substrate electrochemical planarization apparatuses may include a chuck body defining a substrate support surface. the apparatuses may include a retaining wall extending from the chuck body. the apparatuses may include an electrolyte delivery port disposed radially inward of the retaining wall. the apparatuses may include a spindle that is positionable over the chuck body. the apparatuses may include an end effector coupled with a lower end of the spindle. the end effector may be conductive. the apparatuses may include an electric contact extending from the chuck body or retaining wall. the apparatuses may include a current source. the current source may be configured to provide an electric current to an electrolyte within an open interior defined by the retaining wall.