Applied materials, inc. (20240420997). SELECTIVE LINER DEPOSITION FOR VIA RESISTANCE REDUCTION
SELECTIVE LINER DEPOSITION FOR VIA RESISTANCE REDUCTION
Organization Name
Inventor(s)
Jiajie Cen of San Jose CA (US)
Zhiyuan Wu of San Jose CA (US)
Yong Jin Kim of Albany CA (US)
Kevin Kashefi of San Ramon CA (US)
SELECTIVE LINER DEPOSITION FOR VIA RESISTANCE REDUCTION
This abstract first appeared for US patent application 20240420997 titled 'SELECTIVE LINER DEPOSITION FOR VIA RESISTANCE REDUCTION
Original Abstract Submitted
methods of forming devices comprise forming a dielectric material on a substrate, the dielectric layer comprising at least one feature defining a gap including sidewalls and a bottom. the methods include passivating a metal material at a bottom of the gap with an alkyl reactant to form a passivation layer on the metal material, the gap defined by the bottom and sidewalls comprising the dielectric material with having a barrier layer thereon. a metal liner is selectively deposited on the barrier layer on the sidewall over the passivation layer on the bottom.