Applied materials, inc. (20240249965). SUBSTRATE SUPPORT CARRIER HAVING MULTIPLE CERAMIC DISCS simplified abstract
SUBSTRATE SUPPORT CARRIER HAVING MULTIPLE CERAMIC DISCS
Organization Name
Inventor(s)
Arvinder Manmohan Singh Chadha of San Jose CA (US)
Jonathan Simmons of San Jose CA (US)
Stephen Donald Prouty of San Jose CA (US)
Christopher Beaudry of Santa Clara CA (US)
Glen T. Mori of Gilroy CA (US)
Anand Durairajan of San Jacinto CA (US)
SUBSTRATE SUPPORT CARRIER HAVING MULTIPLE CERAMIC DISCS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240249965 titled 'SUBSTRATE SUPPORT CARRIER HAVING MULTIPLE CERAMIC DISCS
The abstract describes a substrate support carrier with an electrostatic chuck assembly that includes a top ceramic disc with a recess, a bottom ceramic disc with a hole, an upper bonding layer, and a porous plug.
- Top ceramic disc with recess
- Bottom ceramic disc with hole
- Upper bonding layer between top and bottom ceramic discs
- Porous plug in recess of top ceramic disc or hole of bottom ceramic disc
- Temperature control base
- Lower bonding layer between bottom ceramic disc and temperature control base
Potential Applications: - Semiconductor manufacturing - Thin film deposition processes - Wafer processing in the electronics industry
Problems Solved: - Ensures secure and stable substrate support during manufacturing processes - Provides precise temperature control for optimal results
Benefits: - Improved efficiency in manufacturing processes - Enhanced quality and consistency of products - Cost-effective solution for substrate support
Commercial Applications: Title: "Advanced Substrate Support Carrier for Semiconductor Manufacturing" This technology can be used in semiconductor fabrication facilities, electronics manufacturing plants, and research institutions to enhance the quality and efficiency of production processes.
Questions about the technology: 1. How does the electrostatic chuck assembly contribute to the stability of the substrate support carrier? 2. What are the advantages of using a porous plug in the ceramic discs for temperature control?
Original Abstract Submitted
a substrate support carrier includes an electrostatic chuck (esc) assembly includes a top ceramic disc having a recess formed from a lower surface of the top ceramic disc, a bottom ceramic disc having a hole through the bottom ceramic disc, an upper bonding layer interposed between the lower surface of the top ceramic disc and an upper surface of the bottom ceramic disc, and a porous plug within at least one of the recess of the top ceramic disc and the hole of the bottom ceramic disc, a temperature control base, and a lower bonding layer interposed between a lower surface of the bottom ceramic disc and an upper surface of the temperature control base.