Applied materials, inc. (20240409449). LASER DICING GLASS WAFERS USING ADVANCED LASER SOURCES

LASER DICING GLASS WAFERS USING ADVANCED LASER SOURCES

Organization Name

applied materials, inc.

Inventor(s)

Wei-Sheng Lei of San Jose CA (US)

Mahendran Chidambaram of Saratoga CA (US)

Kangkang Wang of San Jose CA (US)

Ludovic Godet of Sunnyvale CA (US)

Visweswaren Sivaramakrishnan of Cupertino CA (US)

LASER DICING GLASS WAFERS USING ADVANCED LASER SOURCES

This abstract first appeared for US patent application 20240409449 titled 'LASER DICING GLASS WAFERS USING ADVANCED LASER SOURCES

Original Abstract Submitted

a method includes forming a plurality of voids within a substrate along a dicing path by exposing the substrate to a first burst of laser pulses at a first location along the dicing path of a respective waveguide combiner. the substrate has a plurality of waveguides. each laser pulse within the first burst forms a respective void within a first column at the first location to form the plurality of voids. the method further includes exposing the substrate to a second burst of laser pulses at a second location along the dicing path of the respective waveguide combiner. each laser pulse within the second burst forms the respective void within a second column at the second location to form the plurality of voids. the first column and the second column are spaced by a pitch between a center of the first column and the second column along the dicing path.