Applied materials, inc. (20240258116). SYSTEMS AND METHODS FOR TITANIUM-CONTAINING FILM REMOVAL simplified abstract

SYSTEMS AND METHODS FOR TITANIUM-CONTAINING FILM REMOVAL

Organization Name

applied materials, inc.

Inventor(s)

Baiwei Wang of Santa Clara CA (US)

Wanxing Xu of Sunnyvale CA (US)

Lisa J. Enman of Sunnyvale CA (US)

Aaron Dangerfield of Fremont CA (US)

Rohan Puligoru Reddy of San Jose CA (US)

Xiaolin C. Chen of San Ramon CA (US)

Mikhail Korolik of San Jose CA (US)

Bhaskar Jyoti Bhuyan of San Jose CA (US)

Zhenjiang Cui of San Jose CA (US)

Anchuan Wang of San Jose CA (US)

SYSTEMS AND METHODS FOR TITANIUM-CONTAINING FILM REMOVAL - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240258116 titled 'SYSTEMS AND METHODS FOR TITANIUM-CONTAINING FILM REMOVAL

The patent application describes a method for semiconductor processing involving the removal of titanium-containing material using an etchant precursor in a processing chamber.

• Flowing an etchant precursor into a semiconductor processing chamber
• Housing a substrate within the processing region
• Contacting the substrate with the etchant precursor
• Removing at least a portion of the titanium-containing material

Potential Applications: - Semiconductor manufacturing - Microelectronics production - Thin film deposition processes

Problems Solved: - Efficient removal of titanium-containing material - Precision in semiconductor processing - Enhanced substrate quality

Benefits: - Improved semiconductor device performance - Cost-effective manufacturing processes - Enhanced product reliability

Commercial Applications: Title: Advanced Semiconductor Processing Method for Titanium Removal This technology can be utilized in the semiconductor industry for the production of high-quality electronic devices, leading to improved performance and reliability. The market implications include increased demand for advanced semiconductor processing equipment and services.

Questions about Semiconductor Processing Methods: 1. How does the use of etchant precursors improve semiconductor processing efficiency?

  - Etchant precursors allow for targeted removal of specific materials, enhancing the precision of the process.

2. What are the potential challenges associated with removing titanium-containing material in semiconductor processing?

  - Ensuring complete removal of the material without damaging the substrate can be a challenge, requiring careful control of process parameters.

Original Abstract Submitted

exemplary semiconductor processing methods may include flowing an etchant precursor into a processing region of a semiconductor processing chamber. a substrate may be housed within the processing region. the substrate may define an exposed region of a titanium-containing material. the methods may include contacting the substrate with the etchant precursor. the methods may include removing at least a portion of the titanium-containing material.