PLASMA UNIFORMITY CONTROL SYSTEM AND METHODS

Organization Name

applied materials, inc.

Inventor(s)

Michael Andrew Stearns of San Jose CA (US)

Alok Ranjan of Santa Clara CA (US)

Kartik Ramaswamy of San Jose CA (US)

Peng Tian of Santa Clara CA (US)

Timothy Joseph Franklin of Campbell CA (US)

Chris Blank of Santa Clara CA (US)

Carlaton Wong of Sunnyvale CA (US)

PLASMA UNIFORMITY CONTROL SYSTEM AND METHODS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240266152 titled 'PLASMA UNIFORMITY CONTROL SYSTEM AND METHODS

Simplified Explanation

This patent application describes an apparatus and methods for plasma processing a substrate using a plasma processing chamber with a planar coil region.

The plasma processing chamber includes a first concentric coil and a second concentric coil controlled by a power supply circuit to adjust the magnetic field and control the plasma density.

Key Features and Innovation

Plasma processing chamber with planar coil region
First and second concentric coils for adjusting magnetic field
Power supply circuit to control plasma density

Potential Applications

This technology can be used in semiconductor manufacturing, thin film deposition, and surface modification processes.

Problems Solved

This technology addresses the need for precise control of plasma density in plasma processing chambers.

Benefits

Improved efficiency in plasma processing
Enhanced control over plasma density
Higher quality substrate processing

Commercial Applications

Semiconductor industry for chip manufacturing
Thin film industry for coating applications
Research institutions for material analysis

Prior Art

Prior art related to this technology can be found in patents and research papers on plasma processing chambers and coil configurations for plasma control.

Frequently Updated Research

Researchers are constantly exploring new ways to optimize plasma processing techniques for various applications.

Questions about Plasma Processing Technology

1. How does the planar coil region in the plasma processing chamber contribute to better substrate processing?

  - The planar coil region allows for more uniform plasma distribution, leading to improved processing results.

2. What are the main advantages of using concentric coils in controlling plasma density?

  - Concentric coils provide precise control over the magnetic field, which directly influences the plasma density and overall processing quality.

Original Abstract Submitted

embodiments of the present disclosure include an apparatus and methods for the plasma processing of a substrate. some embodiments are directed to a plasma processing chamber. the plasma processing chamber generally includes a planar coil region comprising a concentric coil region comprising a first concentric coil and a second concentric coil, and a power supply circuit coupled to the first concentric coil and the second concentric coil. the first concentric coil may include a first coil with a diameter measured in a direction parallel to a first plane that is smaller than the diameter of a second coil included in the second concentric coil. the power supply circuit may be configured to bias the first concentric coil and the second concentric coil to adjust a generated magnetic field in a region of control of a plasma in the plasma processing chamber to control a plasma density of the plasma.