Applied materials, inc. (20240258103). PLASMA TREATMENT OF BARRIER AND LINER LAYERS simplified abstract

PLASMA TREATMENT OF BARRIER AND LINER LAYERS

Organization Name

applied materials, inc.

Inventor(s)

Jiajie Cen of San Jose CA (US)

Ge Qu of Sunnyvale CA (US)

Shinjae Hwang of Santa Clara CA (US)

Zheng Ju of Sunnyvale CA (US)

Yang Zhou of Milpitas CA (US)

Zhiyuan Wu of San Jose CA (US)

Feng Chen of San Jose CA (US)

Kevin Kashefi of San Ramon CA (US)

PLASMA TREATMENT OF BARRIER AND LINER LAYERS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240258103 titled 'PLASMA TREATMENT OF BARRIER AND LINER LAYERS

• • Simplified Explanation:**

The patent application relates to methods for forming electrical interconnects and improving film and material properties through the formation and treatment of barrier and liner layers. The resulting composite layers aim to enhance resistivity, reduce void formation, and enhance device reliability.

• • Key Features and Innovation:**

- Methods for forming electrical interconnects - Treatment of barrier and liner layers to improve film and material properties - Composite layers with enhanced resistivity and reduced void formation - Improved device reliability

• • Potential Applications:**

- Semiconductor manufacturing - Electronics industry - Integrated circuit fabrication

• • Problems Solved:**

- Enhancing resistivity of composite layers - Reducing void formation in materials - Improving device reliability in electronic components

• • Benefits:**

- Enhanced performance of electrical interconnects - Increased durability of materials - Improved reliability of electronic devices

• • Commercial Applications:**

Title: Advanced Methods for Electrical Interconnect Formation in Semiconductor Manufacturing This technology can be applied in the semiconductor manufacturing industry to improve the quality and reliability of electronic components. By enhancing resistivity and reducing void formation, companies can produce more efficient and durable devices, leading to increased market competitiveness and customer satisfaction.

• • Questions about Electrical Interconnect Formation:**

1. How do the methods described in the patent application contribute to improving device reliability?

  - The methods focus on enhancing resistivity and reducing void formation in composite layers, which ultimately leads to improved device reliability.

2. What are the potential implications of using these advanced techniques in semiconductor manufacturing?

  - By implementing these methods, companies can expect higher quality products, increased efficiency, and improved performance in electronic devices.

Original Abstract Submitted

embodiments of the disclosure relate to methods for forming electrical interconnects. additional embodiments provide methods of forming and treating barrier and liner layers to improve film and material properties. in some embodiments, the resulting composite layers provide improved resistivity, decrease void formation and improve device reliability.