Applied materials, inc. (20240249918). Processing Chamber With Multiple Plasma Units simplified abstract

Processing Chamber With Multiple Plasma Units

Organization Name

applied materials, inc.

Inventor(s)

Kazuya Daito of Milipitas CA (US)

Yi Xu of San Jose CA (US)

Yu Lei of Belmont CA (US)

Takashi Kuratomi of San Jose CA (US)

Jallepally Ravi of San Ramon CA (US)

Pingyan Lei of San Jose CA (US)

Dien-Yeh Wu of San Jose CA (US)

Processing Chamber With Multiple Plasma Units - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240249918 titled 'Processing Chamber With Multiple Plasma Units

The patent application describes a processing chamber equipped with both a remote plasma unit and a direct plasma unit to handle semiconductor substrate processing.

• The processing chamber contains a remote plasma unit and a direct plasma unit.
• One unit generates a remote plasma while the other generates a direct plasma.
• The combination of these units is used for various substrate processing tasks like etching, cleaning, and thin film deposition.

Potential Applications: - Semiconductor manufacturing - Thin film deposition processes - Surface cleaning and treatment in various industries

Problems Solved: - Efficient removal of residue on substrates - Precise control over thin film deposition - Enhanced cleaning and treatment processes

Benefits: - Improved substrate processing efficiency - Enhanced control over surface treatments - Higher quality thin film deposition

Commercial Applications: Title: Advanced Semiconductor Substrate Processing Chamber This technology can be used in semiconductor fabrication facilities, research institutions, and industries requiring precise substrate processing for various applications.

Prior Art: Researchers can explore prior patents related to semiconductor processing chambers, plasma units, and thin film deposition technologies to understand the evolution of this field.

Frequently Updated Research: Researchers can stay updated on advancements in plasma processing, thin film deposition techniques, and semiconductor substrate cleaning methods to enhance the efficiency and capabilities of this technology.

Questions about Semiconductor Substrate Processing Chamber: 1. How does the combination of remote plasma and direct plasma units improve substrate processing efficiency? - The combination allows for a more versatile and precise control over various processing tasks, leading to enhanced efficiency. 2. What are the key differences between remote plasma and direct plasma units in substrate processing? - Remote plasma units generate plasma outside the processing chamber, while direct plasma units create plasma directly on the substrate, each offering unique advantages in different processing scenarios.

Original Abstract Submitted

provided is a processing chamber configured to contain a semiconductor substrate in a processing region of the chamber. the processing chamber includes a remote plasma unit and a direct plasma unit, wherein one of the remote plasma unit or the direct plasma unit generates a remote plasma and the other of the remote plasma unit or the direct plasma unit generates a direct plasma. the combination of a remote plasma unit and a direct plasma unit is used to remove, etch, clean, or treat residue on a substrate from previous processing and/or from native oxide formation. the combination of a remote plasma unit and direct plasma unit is used to deposit thin films on a substrate.