Applied materials, inc. (20240249924). BIPOLAR ELECTROSTATIC CHUCK ELECTRODE DESIGNS simplified abstract
BIPOLAR ELECTROSTATIC CHUCK ELECTRODE DESIGNS
Organization Name
Inventor(s)
Kallol Bera of Fremont CA (US)
Edward P. Hammond of Hillsborough CA (US)
Dmitry A. Dzilno of Sunnyvale CA (US)
Juan Carlos Rocha-alvarez of San Carlos CA (US)
BIPOLAR ELECTROSTATIC CHUCK ELECTRODE DESIGNS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240249924 titled 'BIPOLAR ELECTROSTATIC CHUCK ELECTRODE DESIGNS
The patent application describes substrate support assemblies with an electrostatic chuck body that includes a substrate support surface and a substrate seat. The assemblies also include a support stem coupled with the electrostatic chuck body, a first bipolar electrode, and a second bipolar electrode embedded within the chuck body.
- The first and second bipolar electrodes are coaxial with each other, with the entirety of the second bipolar electrode being radially inward of at least a portion of the first bipolar electrode.
- Both the first and second bipolar electrodes are coupled with at least one RF power supply and at least one DC power supply.
Potential Applications: - Semiconductor manufacturing - Thin film deposition processes - Wafer bonding processes
Problems Solved: - Secure and stable support for substrates during processing - Efficient and uniform distribution of power for electrostatic chuck operation
Benefits: - Improved processing efficiency - Enhanced substrate stability - Precise control over substrate positioning
Commercial Applications: Title: Advanced Substrate Support Assemblies for Semiconductor Manufacturing This technology can be used in semiconductor fabrication facilities to enhance the efficiency and accuracy of various processes, leading to improved product quality and production yields.
Questions about the technology: 1. How does the design of the substrate support assemblies contribute to the stability of substrates during processing? - The design of the assemblies, including the coaxial arrangement of the bipolar electrodes, ensures secure and stable support for substrates, preventing movement or misalignment during processing.
2. What are the advantages of coupling the bipolar electrodes with both RF and DC power supplies? - By coupling the electrodes with both types of power supplies, the assemblies can efficiently and effectively distribute power for electrostatic chuck operation, ensuring precise control over substrate positioning and stability.
Original Abstract Submitted
exemplary substrate support assemblies may include an electrostatic chuck body defining a substrate support surface that defines a substrate seat. the assemblies may include a support stem coupled with the electrostatic chuck body. the assemblies may include a first bipolar electrode embedded within the electrostatic chuck body. the assemblies may include a second bipolar electrode embedded within the electrostatic chuck body. an entirety of the second bipolar electrode may be radially inward of at least a portion of the first bipolar electrode. the first bipolar electrode and the second bipolar electrode may be coaxial with one another. each of the first bipolar electrode and the second bipolar electrode may be coupled with at least one rf power supply. each of the first bipolar electrode and the second bipolar electrode may be coupled with at least one dc power supply.