Applied materials, inc. (20240258153). APPARATUS AND METHODS FOR SEMICONDUCTOR PROCESSING simplified abstract

APPARATUS AND METHODS FOR SEMICONDUCTOR PROCESSING

Organization Name

applied materials, inc.

Inventor(s)

Joseph Yudovsky of Campbell CA (US)

Kaushal Gangakhedkar of San Jose CA (US)

APPARATUS AND METHODS FOR SEMICONDUCTOR PROCESSING - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240258153 titled 'APPARATUS AND METHODS FOR SEMICONDUCTOR PROCESSING

The patent application describes apparatus and methods for processing a semiconductor wafer to ensure it remains in place during processing by subjecting it to a pressure differential between the top and bottom surfaces. This pressure differential is achieved by applying decreased pressure to the back side of the wafer.

• The innovation involves using pressure differentials to prevent the wafer from moving during processing.
• By applying decreased pressure to the back side of the wafer, a sufficient force is generated to keep the wafer in place.
• This method ensures the wafer remains stable and secure during various processing steps.
• The technology aims to improve the efficiency and accuracy of semiconductor wafer processing.
• The invention can potentially lead to higher yields and better quality in semiconductor manufacturing processes.

Potential Applications: - Semiconductor manufacturing - Microelectronics industry - Wafer processing facilities

Problems Solved: - Movement of wafers during processing - Ensuring stability and accuracy in semiconductor manufacturing

Benefits: - Improved efficiency in wafer processing - Enhanced quality control in semiconductor manufacturing - Higher yields in semiconductor production

Commercial Applications: Title: "Enhancing Semiconductor Manufacturing Efficiency with Pressure Differential Technology" This technology can be utilized in semiconductor fabrication facilities to streamline wafer processing, leading to increased productivity and improved product quality. The market implications include cost savings, faster production cycles, and a competitive edge in the semiconductor industry.

Questions about Pressure Differential Technology: 1. How does the pressure differential technology prevent the wafer from moving during processing?

  - The pressure differential created by applying decreased pressure to the back side of the wafer generates sufficient force to keep it in place.

2. What are the potential benefits of using pressure differentials in semiconductor wafer processing?

  - The benefits include improved efficiency, higher yields, and better quality control in semiconductor manufacturing processes.

Original Abstract Submitted

described are apparatus and methods for processing a semiconductor wafer so that the wafer remains in place during processing. the wafer is subjected to a pressure differential between the top surface and bottom surface so that sufficient force prevents the wafer from moving during processing, the pressure differential generated by applying a decreased pressure to the back side of the wafer.