Applied materials, inc. (20240339302). ELECTRICAL BREAK FOR SUBSTRATE PROCESSING SYSTEMS simplified abstract

ELECTRICAL BREAK FOR SUBSTRATE PROCESSING SYSTEMS

Organization Name

applied materials, inc.

Inventor(s)

Yogananda Sarode Vishwanath of Bangalore (IN)

Andrew Nguyen of San Jose CA (US)

Tom K. Cho of Los Altos Hills CA (US)

ELECTRICAL BREAK FOR SUBSTRATE PROCESSING SYSTEMS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240339302 titled 'ELECTRICAL BREAK FOR SUBSTRATE PROCESSING SYSTEMS

The patent application describes systems, methods, and apparatus for a gas break used in semiconductor processing systems. The apparatus includes a gas break structure made of an insulating material with gas flow paths, providing a specified impedance between a grounded gas distribution manifold and an electrically charged gas delivery nozzle. The internal structure of the gas break has a specific geometry with repeating structures and empty gaps between elements.

• Gas break structure made of insulating material
• Gas flow paths within the structure
• Provides specified impedance between gas distribution manifold and gas delivery nozzle
• Internal structure with repeating structures and empty gaps
• Can be formed using additive manufacturing

Potential Applications: - Semiconductor processing systems - Gas delivery systems in various industries

Problems Solved: - Preventing electrical discharge in gas delivery systems - Ensuring proper impedance matching in semiconductor processing

Benefits: - Improved safety in gas delivery systems - Enhanced performance in semiconductor processing

Commercial Applications: Gas break structures can be used in semiconductor manufacturing facilities, gas delivery systems for chemical processing, and other industries requiring precise gas flow control.

Questions about Gas Break Technology: 1. How does the gas break structure prevent electrical discharge in semiconductor processing systems? 2. What are the advantages of using additive manufacturing to create gas breaks?

Original Abstract Submitted

systems, methods, and apparatus including designs embodied in machine-readable media for a gas break used in semiconductor processing systems. the apparatus includes a gas break structure comprising an insulating material and having one or more gas flow paths formed within a body of the gas break structure, the gas break structure configured to provide a specified impedance when coupled between a grounded gas distribution manifold and an electrically charged gas delivery nozzle, the gas break structure further comprising an internal structure having a specified geometry comprising a repeating structure and one or more empty gaps between elements of the repeating structure. the gas break can be formed using additive manufacturing.