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Category:H05K1/02
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Pages in category "H05K1/02"
The following 200 pages are in this category, out of 217 total.
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- 16976907. ANTENNA AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17280888. DISPLAY PANEL AND DISPLAY DEVICE simplified abstract (WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.)
- 17383241. PACKAGE COMPRISING A BLOCK DEVICE WITH A SHIELD simplified abstract (QUALCOMM Incorporated)
- 17644431. Integrated Attenuator with Thermal Vias simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17709920. INSULATING MEMBER ARRANGEMENT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17745238. ANTENNA STRUCTURE SUPPORTING WIRELESS CHARGING AND ELECTRONIC DEVICE HAVING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17825508. BOARD HAVING CONDUCTIVE LAYER FOR SHIELDING ELECTRONIC COMPONENT AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17848092. STACK-PCB ARCHITECTURE WITH EMBEDDED VAPOR CHAMBER simplified abstract (Meta Platforms Technologies, LLC)
- 17849093. CIRCUIT BOARD STRUCTURES FOR COMPONENT PROTECTION simplified abstract (MICRON TECHNOLOGY, INC.)
- 17850555. MULTIMEDIA STREAMING DEVICE simplified abstract (Amazon Technologies, Inc.)
- 17877729. FLEXIBLE WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC APPARATUS simplified abstract (CANON KABUSHIKI KAISHA)
- 17879303. FLEXIBLE CONNECTING MEMBER AND ELECTRONIC DEVICE INCLUDING SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17885338. STRESS-RELEASING SOLDER MASK PATTERN FOR SEMICONDUCTOR DEVICES AND RELATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
- 17885640. DISPLAY DEVICE simplified abstract (Samsung Display Co., Ltd.)
- 17921887. FLEXIBLE PRINTED CIRCUIT BOARD AND DISPLAY DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 17933693. MICROSTRIP CROSSTALK REDUCTION simplified abstract (International Business Machines Corporation)
- 17947397. MODULE BOARD AND MEMORY MODULE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO.,LTD.)
- 17948854. MICROSTRIP DELAY MATCHING USING PRINTED DIELECTRIC MATERIAL simplified abstract (Dell Products L.P.)
- 17948893. STRIP LINE DELAY MATCHING USING PRINTED DIELECTRIC MATERIAL simplified abstract (Dell Products L.P.)
- 17957316. PRINTED CIRCUIT BOARD INCLUDING COAXIAL PLATED THROUGH HOLE AND ELECTRONIC APPARATUS INCLUDING SAME IN WIRELESS COMMUNICATION SYSTEM simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17957330. NON-PLANAR ANTENNAS FOR PORTABLE STORAGE DEVICES simplified abstract (Western Digital Technologies, Inc.)
- 17957870. PRINTED CIRCUIT BOARD FOR TRANSMITTING SIGNAL IN HIGH-FREQUENCY BAND AND ELECTRONIC DEVICE COMPRISING SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17960404. ELECTRONIC DEVICE INCLUDING HEAT RADIATING STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17962286. RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17963138. TEARING SECURITY FEATURE OF PRINTED CIRCUIT SUBSTRATES simplified abstract (International Business Machines Corporation)
- 17967532. PRINTED CIRCUIT BOARD WITH INCREASED DURABILITY IN BENDING REGION AND ELECTRONIC DEVICE INCLUDING SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17968308. PRINTED CIRCUIT BOARD, FABRICATION METHOD OF THE SAME AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17968438. INFORMATION HANDLING SYSTEM AND PERIPHERAL PRINTED CIRCUIT BOARD HAVING NON-HOMOGENEOUS SUBSTRATE MATERIAL AND INTEGRATED THERMAL SOLUTION simplified abstract (Dell Products L.P.)
- 17974982. WEARABLE ELECTRONIC DEVICE INCLUDING ANTENNA simplified abstract (Samsung Electronics Co., Ltd.)
- 17986242. ELECTRONIC DEVICE INCLUDING SHEILDING STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18039454. CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME simplified abstract (LG INNOTEK CO., LTD.)
- 18048155. SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF STORAGE DEVICES simplified abstract (Dell Products L.P.)
- 18048622. IMAGE PICKUP APPARATUS simplified abstract (CANON KABUSHIKI KAISHA)
- 18071903. PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18073966. PRINTED CIRCUIT BOARD INTEGRATED ANTENNA FOR TRANSMITTING / RECEIVING DATA simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18075010. ELECTRONIC DEVICE INCLUDING FLEXIBLE PRINTED CIRCUIT BOARD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18077570. WIRELESS INTERCONNECT FOR HIGH-RATE DATA TRANSFER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18090214. ELECTRONIC DEVICE INCLUDING HIGH-FREQUENCY TRANSMISSION CIRCUIT simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18091368. ELECTRONIC DEVICE INCLUDING PRINTED CIRCUIT BOARD STRUCTURE INCLUDING THERMAL INTERFACE MATERIAL simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18094683. FLEXIBLE PRINTED CIRCUIT AND MANUFACTURING METHOD THEREOF, ELECTRONIC DEVICE MODULE AND ELECTRONIC DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 18106435. DISPLAY UNIT, ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE ELECTRONIC APPARATUS simplified abstract (SAMSUNG DISPLAY CO., LTD.)
- 18118725. ELECTRONIC DEVICE simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18118725. ELECTRONIC DEVICE simplified abstract (TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION)
- 18139900. FLEXIBLE CIRCUIT FILM AND DISPLAY APPARATUS HAVING THE SAME simplified abstract (Samsung Display Co., Ltd.)
- 18154433. ANTENNA FILTER AND ELECTRONIC DEVICE INCLUDING SAME IN WIRELESS COMMUNICATION SYSTEM simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18155759. LAYOUT STRUCTURE AND METHOD FOR FABRICATING SAME simplified abstract (Changxin Memory Technologies, Inc.)
- 18161272. ELECTRONIC DEVICE INCLUDING MULTIPLE PRINTED CIRCUIT BOARDS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18164788. CIRCUIT BOARD HAVING ELECTROMAGNETIC SHIELDING STRUCTURE AND ELECTRONIC DEVICE INCLUDING SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18165182. DISPLAY DEVICE AND ELECTRONIC DEVICE HAVING THE SAME simplified abstract (SAMSUNG DISPLAY CO., LTD.)
- 18173767. ISOLATOR simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18195454. DISPLAY DEVICE simplified abstract (Samsung Display Co., Ltd.)
- 18225944. Methods and Structures for Coupling Thermal Dissipating Elements and Thermal Cooling Structures to Integrated Circuit Dies simplified abstract (GOOGLE LLC)
- 18230027. ELECTRONIC DEVICE INCLUDING FLEXIBLE PRINTED CIRCUIT BOARD AND OPERATING METHOD THEREOF simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18231289. METHOD OF MANUFACTURING ELECTRONIC DEVICE simplified abstract (Samsung Display Co., LTD.)
- 18266254. SYSTEMS AND METHODS FOR FLEX CIRCUIT CONNECTIONS IN TOUCH SCREENS simplified abstract (Apple Inc.)
- 18267115. CIRCUIT BOARD simplified abstract (Mitsubishi Electric Corporation)
- 18298667. SUBSTRATE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18313722. WIRELESS MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18323880. ELECTRONIC DEVICE INCLUDING HEAT PIPE SURROUNDING MULTIPLE INTEGRATED CIRCUITS simplified abstract (Samsung Electronics Co., Ltd.)
- 18331759. SENSOR UNIT AND IMAGE FORMING APPARATUS INCLUDING SENSOR UNIT simplified abstract (CANON KABUSHIKI KAISHA)
- 18336096. FILM PACKAGE AND PACKAGE MODULE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18344308. COLD PLATES FOR SECONDARY SIDE COMPONENTS OF PRINTED CIRCUIT BOARDS simplified abstract (Intel Corporation)
- 18353384. BATTERY AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18374481. CIRCUIT BOARD UNIT AND ELECTRONIC APPARATUS simplified abstract (SEIKO EPSON CORPORATION)
- 18375156. PRINTED CIRCUIT BOARD ASSEMBLY INCLUDING THERMAL MODULE simplified abstract (Samsung Electronics Co., Ltd.)
- 18375179. ELECTRONIC APPARATUS FOR STABLE ELECTRICAL CONNECTION simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18384181. FOLDABLE COVER AND DISPLAY FOR AN ELECTRONIC DEVICE simplified abstract (Apple Inc.)
- 18387351. FLEXIBLE CIRCUIT BOARD AND FOLDABLE ELECTRONIC DEVICE COMPRISING SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18389923. HEAT DISSIPATION APPARATUS, CIRCUIT MODULE, ELECTRONIC DEVICE, AND CIRCUIT MODULE ASSEMBLY METHOD simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18390805. HEATSINK BASED POWER DELIVERY FOR CPUS simplified abstract (Dell Products L.P.)
- 18399565. TECHNOLOGIES FOR A FLEXIBLE 3D POWER PLANE IN A CHASSIS simplified abstract (Intel Corporation)
- 18400022. PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE simplified abstract (Huawei Technologies Co., Ltd.)
- 18400347. ELECTRONIC APPARATUS simplified abstract (Samsung Display Co., LTD.)
- 18453020. FLEXIBLE PRINTED CIRCUIT AND ELECTRONIC DEVICE simplified abstract (Lenovo (Beijing) Limited)
- 18465803. LIGHT-EMITTING MODULE, METHOD OF MANUFACTURING WIRING SUBSTRATE, AND METHOD OF MANUFACTURING LIGHT-EMITTING MODULE simplified abstract (NICHIA CORPORATION)
- 18470805. DISPLAY MODULE ACCOUNTING FOR ESD PHENOMENON, AND ELECTRONIC DEVICE COMPRISING DISPLAY MODULE simplified abstract (Samsung Electronics Co., Ltd.)
- 18472241. STRETCHABLE DEVICE simplified abstract (Japan Display Inc.)
- 18479767. SYSTEMS, METHODS, AND DEVICES FOR PRODUCING INTERCONNECTS ON DEFORMABLE SUBSTRATES OF ELECTRONIC DEVICES simplified abstract (Meta Platforms Technologies, LLC)
- 18480343. WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC DEVICE simplified abstract (CANON KABUSHIKI KAISHA)
- 18480507. STRETCHABLE DEVICE simplified abstract (Japan Display Inc.)
- 18481931. SYSTEMS AND METHODS FOR IMPLEMENTING A SCALABLE SYSTEM simplified abstract (Apple Inc.)
- 18484580. HEAT CONDUCTING MEMBER, OPTICAL MODULE, HEAT SINK, AND METHOD FOR PREPARING HEAT CONDUCTING MEMBER simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18490597. FLEXIBLE WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC APPARATUS simplified abstract (CANON KABUSHIKI KAISHA)
- 18492251. COMPUTER HOUSING simplified abstract (Apple Inc.)
- 18495735. VEHICLE-MOUNTABLE DEVICE AND VEHICLE simplified abstract (Huawei Technologies Co., Ltd.)
- 18501089. ELECTRONIC APPARATUS AND IMAGE PICKUP APPARATUS simplified abstract (CANON KABUSHIKI KAISHA)
- 18510822. PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)
- 18512344. HEAT DISSIPATION APPARATUS AND IN-VEHICLE MODULE simplified abstract (Huawei Technologies Co., Ltd.)
- 18512862. BATTERY INCLUDING FLEXIBLE CIRCUIT BOARD CONNECTED FROM SIDE OF PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE INCLUDING THE BATTERY simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18520642. CIRCUIT BOARD FOR HIGH FREQUENCY DEVICES, AND HIGH FREQUENCY DEVICE simplified abstract (AGC Inc.)
- 18521235. BRUSHLESS DIRECT CURRENT MOTOR FOR POWER TOOLS simplified abstract (Milwaukee Electric Tool Corporation)
- 18523058. TERMINAL STRUCTURE AND ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18525081. POWER ADAPTER AND ELECTRONIC DEVICE SYSTEM simplified abstract (Huawei Digital Power Technologies Co., Ltd.)
- 18525528. Electronic Device With Near-Field Antenna Operating Through Display simplified abstract (Apple Inc.)
- 18525735. Flexible Connector with Permeability Shield to Reduce Antenna Loss simplified abstract (Google LLC)
- 18530179. MICROELECTRONIC DEVICE PACKAGE INCLUDING ANTENNA AND SEMICONDUCTOR DEVICE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18542619. COUPLER AND ELECTRONIC DEVICE simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18548216. FLEXIBLE PRINTED BOARD simplified abstract (Mitsubishi Electric Corporation)
- 18554170. WIRING BOARD simplified abstract (NIPPON TELEGRAPH AND TELEPHONE CORPORATION)
2
- 20240014794. Impedence Matching Conductive Structure for High Efficiency RF Circuits simplified abstract (3D Glass Solutions, Inc.)
- 20240015881. PRINTED CIRCUIT BOARD (PCB) COOLING simplified abstract (Raytheon Technologies Corporation)
- 20240018019. HEAT DISSIPATION APPARATUS AND METHODS FOR UV-LED PHOTOREACTORS simplified abstract (THE UNIVERSITY OF BRITISH COLUMBIA)
- 20240018295. THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND PRINTED WIRING BOARD simplified abstract (TAIYO INK MFG. CO., LTD.)
- 20240032185. Heat Sink Component Terminations simplified abstract (KYOCERA AVX Components Corporation)
- 20240032186. STRUCTURE, METHOD FOR MANUFACTURING STRUCTURE, AND COMPOSITION simplified abstract (FUJIFILM Corporation)
- 20240047844. HYBRID COUPLER AND METHOD FOR MANUFACTURING HYBRID COUPLERS simplified abstract (CommScope Technologies LLC)
- 20240049382. CARRIER STRUCTURE simplified abstract (SILICONWARE PRECISION INDUSTRIES CO., LTD.)
- 20240049388. SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS simplified abstract (DexCom, Inc.)
- 20240049392. Overlap Joint Flex Circuit Board Interconnection simplified abstract (Google LLC)
- 20240053804. COMPUTER HOUSING simplified abstract (Apple Inc.)
A
- Apple inc. (20240097309). Electronic Device With Near-Field Antenna Operating Through Display simplified abstract
- Apple Inc. patent applications on February 15th, 2024
- Apple Inc. patent applications on February 1st, 2024
- Apple Inc. patent applications on February 8th, 2024
- Apple Inc. patent applications on January 25th, 2024
- Apple Inc. patent applications on March 21st, 2024
- Audio Technologies patent applications on March 14th, 2024
B
- Blockchain patent applications on 22nd Mar 2024
- Blockchain patent applications on April 18th, 2024
- Blockchain patent applications on April 25th, 2024
- Blockchain patent applications on February 15th, 2024
- Blockchain patent applications on February 22nd, 2024
- Blockchain patent applications on February 29th, 2024
- Blockchain patent applications on February 8th, 2024
- Blockchain patent applications on January 11th, 2024
- Blockchain patent applications on January 18th, 2024
- Blockchain patent applications on January 25th, 2024
- Blockchain patent applications on March 14th, 2024
- Blockchain patent applications on March 21st, 2024
- Blockchain patent applications on March 28th, 2024
C
- Canon kabushiki kaisha (20240121885). WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC DEVICE simplified abstract
- Canon kabushiki kaisha (20240138057). FLEXIBLE WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC APPARATUS simplified abstract
- CANON KABUSHIKI KAISHA patent applications on April 11th, 2024
- CANON KABUSHIKI KAISHA patent applications on April 25th, 2024
- CANON KABUSHIKI KAISHA patent applications on February 29th, 2024
- CANON KABUSHIKI KAISHA patent applications on January 18th, 2024
- CANON KABUSHIKI KAISHA patent applications on January 25th, 2024
D
- Dell products l.p. (20240098883). MICROSTRIP DELAY MATCHING USING PRINTED DIELECTRIC MATERIAL simplified abstract
- Dell products l.p. (20240098886). STRIP LINE DELAY MATCHING USING PRINTED DIELECTRIC MATERIAL simplified abstract
- Dell products l.p. (20240130033). HEATSINK BASED POWER DELIVERY FOR CPUS simplified abstract
- Dell products l.p. (20240130041). INFORMATION HANDLING SYSTEM AND PERIPHERAL PRINTED CIRCUIT BOARD HAVING NON-HOMOGENEOUS SUBSTRATE MATERIAL AND INTEGRATED THERMAL SOLUTION simplified abstract
- Dell Products L.P. patent applications on April 18th, 2024
- Dell Products L.P. patent applications on April 25th, 2024
- Dell Products L.P. patent applications on January 18th, 2024
- Dell Products L.P. patent applications on January 25th, 2024
- Dell Products L.P. patent applications on March 21st, 2024
G
- Google llc (20240097321). Flexible Connector with Permeability Shield to Reduce Antenna Loss simplified abstract
- Google llc (20240121931). Methods and Structures for Coupling Thermal Dissipating Elements and Thermal Cooling Structures to Integrated Circuit Dies simplified abstract
- GOOGLE LLC patent applications on April 11th, 2024
- Google LLC patent applications on February 8th, 2024
- Google LLC patent applications on March 21st, 2024
H
- Huawei technologies co., ltd. (20240107656). CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE simplified abstract
- Huawei technologies co., ltd. (20240120632). COUPLER AND ELECTRONIC DEVICE simplified abstract
- Huawei technologies co., ltd. (20240121881). HEAT DISSIPATION APPARATUS, CIRCUIT MODULE, ELECTRONIC DEVICE, AND CIRCUIT MODULE ASSEMBLY METHOD simplified abstract
- Huawei technologies co., ltd. (20240138060). PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE simplified abstract
- HUAWEI TECHNOLOGIES CO., LTD. patent applications on April 11th, 2024
- Huawei Technologies Co., Ltd. patent applications on April 25th, 2024
- Huawei Technologies Co., Ltd. patent applications on February 15th, 2024
- HUAWEI TECHNOLOGIES CO., LTD. patent applications on February 1st, 2024
- HUAWEI TECHNOLOGIES CO., LTD. patent applications on February 29th, 2024
- Huawei Technologies Co., Ltd. patent applications on March 14th, 2024
- HUAWEI TECHNOLOGIES CO., LTD. patent applications on March 28th, 2024
I
- Intel corporation (20240130068). TECHNOLOGIES FOR A FLEXIBLE 3D POWER PLANE IN A CHASSIS simplified abstract
- Intel Corporation patent applications on April 18th, 2024
- International business machines corporation (20240098882). MICROSTRIP CROSSTALK REDUCTION simplified abstract
- International business machines corporation (20240121890). TEARING SECURITY FEATURE OF PRINTED CIRCUIT SUBSTRATES simplified abstract
- International Business Machines Corporation patent applications on April 11th, 2024
- International Business Machines Corporation patent applications on March 21st, 2024
K
M
- Meta platforms technologies, llc (20240098877). STACK-PCB ARCHITECTURE WITH EMBEDDED VAPOR CHAMBER simplified abstract
- Meta platforms technologies, llc (20240114630). SYSTEMS, METHODS, AND DEVICES FOR PRODUCING INTERCONNECTS ON DEFORMABLE SUBSTRATES OF ELECTRONIC DEVICES simplified abstract
- Meta platforms technologies, llc (20240121882). THERMOPLASTIC INTERPOSER simplified abstract
- Meta platforms technologies, llc (20240132739). OPTIMIZED SOLVENT-BASED LIQUID METAL COMPOSITIONS AND METHODS OF USING SAME simplified abstract
- Meta Platforms Technologies, LLC patent applications on April 11th, 2024
- Meta Platforms Technologies, LLC patent applications on April 25th, 2024
- Meta Platforms Technologies, LLC patent applications on April 4th, 2024
- Meta Platforms Technologies, LLC patent applications on March 21st, 2024
- Micron Technology, Inc. patent applications on February 15th, 2024
- Murata Manufacturing Co., Ltd. patent applications on January 18th, 2024
N
Q
- Qualcomm incorporated (20240106115). LOW-LOSS SMALL FORM-FACTOR BUTLER MATRIX simplified abstract
- Qualcomm incorporated (20240107665). PROVIDING A LOWER INDUCTANCE PATH IN A ROUTING SUBSTRATE FOR A CAPACITOR, AND RELATED ELECTRONIC DEVICES AND FABRICATION METHODS simplified abstract
- QUALCOMM Incorporated patent applications on March 28th, 2024
- Quantum Computing patent applications on February 8th, 2024
S
- Samsung display co., ltd. (20240098894). DISPLAY DEVICE simplified abstract
- Samsung display co., ltd. (20240098900). FLEXIBLE CIRCUIT FILM AND DISPLAY APPARATUS HAVING THE SAME simplified abstract
- Samsung display co., ltd. (20240138065). ELECTRONIC APPARATUS simplified abstract
- Samsung display co., ltd. (20240138072). METHOD OF MANUFACTURING ELECTRONIC DEVICE simplified abstract
- Samsung Display Co., LTD. patent applications on April 25th, 2024
- SAMSUNG DISPLAY CO., LTD. patent applications on January 25th, 2024
- Samsung Display Co., Ltd. patent applications on March 21st, 2024
- Samsung electronics co., ltd. (20240098940). PRINTED CIRCUIT BOARD ASSEMBLY INCLUDING THERMAL MODULE simplified abstract
- Samsung electronics co., ltd. (20240129388). ELECTRONIC DEVICE INCLUDING ELASTIC MEMBER simplified abstract
- Samsung Electronics Co., Ltd. patent applications on April 18th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 15th, 2024
- Samsung Electronics Co., Ltd. patent applications on February 29th, 2024