Meta platforms technologies, llc (20240121882). THERMOPLASTIC INTERPOSER simplified abstract
Contents
- 1 THERMOPLASTIC INTERPOSER
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 THERMOPLASTIC INTERPOSER - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
THERMOPLASTIC INTERPOSER
Organization Name
meta platforms technologies, llc
Inventor(s)
Brian Toleno of Cupertino CA (US)
Michael Nikkhoo of Saratoga CA (US)
Arman Boromand of Issaquah WA (US)
Andrew John Ouderkirk of Kirkland WA (US)
Jonathan Robert Peterson of Woodinville WA (US)
THERMOPLASTIC INTERPOSER - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240121882 titled 'THERMOPLASTIC INTERPOSER
Simplified Explanation
The patent application describes a thermoplastic interposer made of ordered polymer sheets that can function as an interconnect and a thermal energy spreader. Laser direct structuring (LDS) is used to create through silicon vias (TSVs) or through-chip vias in the interposer. The ordered polymer sheets are extruded via a roll-to-roll process, stacked, and processed to form a laminate interposer structure for use in multi-layer structures connecting printed circuit boards (PCBs).
- Thermoplastic interposer made of ordered polymer sheets
- Can act as an interconnect and thermal energy spreader
- Laser direct structuring used to create TSVs or through-chip vias
- Extruded via roll-to-roll process and stacked to form laminate structure
- Used in multi-layer structures connecting PCBs
Potential Applications
The technology could be applied in various electronic devices and systems where thermal management and interconnectivity are crucial, such as:
- High-performance computing systems
- Telecommunications equipment
- Automotive electronics
- Aerospace applications
Problems Solved
The thermoplastic interposer addresses the following issues:
- Improved thermal management in electronic devices
- Enhanced interconnectivity between components
- Reduction of heat-related failures and performance degradation
Benefits
The use of the thermoplastic interposer offers several advantages, including:
- Efficient heat dissipation
- Enhanced reliability of electronic systems
- Simplified manufacturing processes
- Cost-effective solution for thermal management and interconnectivity
Potential Commercial Applications
The technology could find commercial applications in industries such as:
- Electronics manufacturing
- Semiconductor packaging
- Telecommunications
- Automotive electronics
Possible Prior Art
One possible prior art could be the use of traditional metal interposers for thermal management and interconnectivity in electronic devices. However, the specific use of ordered polymer sheets and laser direct structuring for creating TSVs or through-chip vias may be novel aspects of this technology.
Unanswered Questions
How does the thermoplastic interposer compare to traditional metal interposers in terms of thermal performance and cost-effectiveness?
The article does not provide a direct comparison between the thermoplastic interposer and traditional metal interposers in terms of thermal performance and cost-effectiveness. Further research or testing may be needed to evaluate these aspects.
Are there any limitations or challenges in implementing the thermoplastic interposer technology in high-volume manufacturing processes?
The article does not discuss any potential limitations or challenges in implementing the thermoplastic interposer technology in high-volume manufacturing processes. Understanding these factors could be crucial for widespread adoption of the technology.
Original Abstract Submitted
a thermoplastic interposer formed of ordered polymer sheets that may be configured to act as an interconnect and as a thermal energy spreader. in examples, the thermoplastic interposer may include one or more extensions or wings to further dissipate heat. in examples, laser direct structuring (lds) may be used to form or more through silicon vias (tsvs) or through-chip vias. in examples, the ordered polymer sheets may be extruded via a roll-to-roll process, stacked, and processed to form a laminate interposer structure that makes up the interposer. in examples, the thermoplastic interposer may be used in multi-layer structures interconnecting two or more board assemblies such as printed circuit boards (pcb)s.
