Kabushiki kaisha toshiba (20240096378). ELECTRONIC DEVICE simplified abstract

ELECTRONIC DEVICE

Organization Name

kabushiki kaisha toshiba

Inventor(s)

Nobuhiro Yamamoto of Yokohama (JP)

Masahide Takazawa of Hachioji Tokyo (JP)

ELECTRONIC DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240096378 titled 'ELECTRONIC DEVICE

Simplified Explanation

The electronic device described in the patent application includes a substrate with an opening, organic compound layer, wiring, and pads attached to a wall.

• The substrate has an opening that penetrates the organic compound layer to open to the first and second surfaces.
• The organic compound layer is sandwiched between the first and second surfaces, with wiring and pads connected to it.
• The first pad is connected to the first wiring, while the second pad is connected to the second wiring away from the first pad.

Potential Applications

This technology could be applied in:

• Flexible electronics
• Wearable devices
• Biomedical sensors

Problems Solved

This technology helps in:

• Improving flexibility of electronic devices
• Enhancing connectivity in compact devices
• Facilitating miniaturization of electronic components

Benefits

The benefits of this technology include:

• Increased durability of electronic devices
• Enhanced performance in harsh environments
• Simplified manufacturing processes

Potential Commercial Applications

The potential commercial applications of this technology could be in:

• Consumer electronics
• Medical devices
• Aerospace industry

Possible Prior Art

There is no known prior art related to this specific technology.

How does this technology impact power consumption in electronic devices?

This article does not address the impact of this technology on power consumption in electronic devices.

What are the potential limitations of implementing this technology in mass production?

This article does not discuss the potential limitations of implementing this technology in mass production.

Original Abstract Submitted

according to one embodiment, an electronic device includes a wall and a substrate. the substrate is provided with an opening. the substrate includes an organic compound layer, a first surface of the organic compound layer, a second surface of the organic compound layer opposite the first surface, first wiring on the second surface, second wiring on the second surface, a first pad, and a second pad. the first surface is attached to the wall. the first pad is connected to the first wiring. the second pad is connected to the second wiring away from the first pad. the opening penetrates the organic compound layer to open to the first surface and the second surface between the first pad and the second pad.