18374481. CIRCUIT BOARD UNIT AND ELECTRONIC APPARATUS simplified abstract (SEIKO EPSON CORPORATION)
Contents
- 1 CIRCUIT BOARD UNIT AND ELECTRONIC APPARATUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CIRCUIT BOARD UNIT AND ELECTRONIC APPARATUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
CIRCUIT BOARD UNIT AND ELECTRONIC APPARATUS
Organization Name
Inventor(s)
Toshiyuki Omori of Tatsuno-machi (JP)
Takeshi Hirai of Kodaira-shi (JP)
CIRCUIT BOARD UNIT AND ELECTRONIC APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18374481 titled 'CIRCUIT BOARD UNIT AND ELECTRONIC APPARATUS
Simplified Explanation
The circuit board unit described in the patent application includes a first circuit board with a ground layer, a second circuit board with a ground layer, a connector unit with connectors attached to each circuit board, and a metal member between the boards to electrically couple the ground layers.
- The first circuit board has a ground layer.
- The second circuit board is positioned opposite the first board and also has a ground layer.
- A connector unit with connectors is attached to both circuit boards.
- A metal member is placed between the circuit boards to connect the ground layers.
- The metal member is located near the connector unit.
Potential Applications
This technology could be used in various electronic devices and systems where reliable grounding between circuit boards is essential, such as in computers, smartphones, and other consumer electronics.
Problems Solved
This innovation solves the problem of ensuring proper grounding between circuit boards in electronic devices, which is crucial for preventing electrical interference and maintaining signal integrity.
Benefits
The benefits of this technology include improved electrical performance, reduced electromagnetic interference, and enhanced overall reliability of electronic devices.
Potential Commercial Applications
This technology could be applied in the manufacturing of a wide range of electronic products, leading to more efficient and reliable devices in the market.
Possible Prior Art
One possible prior art could be the use of separate grounding wires or traces on circuit boards to connect ground layers, which may not be as effective or efficient as the metal member described in this patent application.
Unanswered Questions
How does this technology impact the overall cost of manufacturing electronic devices?
The article does not provide information on the cost implications of implementing this technology in electronic devices.
Are there any specific industry standards or regulations that this technology needs to comply with?
The article does not address whether this technology needs to meet any specific industry standards or regulations in the electronic manufacturing sector.
Original Abstract Submitted
A circuit board unit includes a first circuit board having a first ground layer, a second circuit board having a second ground layer and arranged so as to be opposed to the first circuit board, a connector unit having a first connector attached to the first circuit board, and a second connector attached to the second circuit board and coupled to the first connector, and a metal member arranged between the first circuit board and the second circuit board, and configured to electrically couple the first ground layer and the second ground layer to each other. The metal member is arranged so as to be adjacent to the connector unit.
