18400022. PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE simplified abstract (Huawei Technologies Co., Ltd.)
Contents
- 1 PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE
Organization Name
Inventor(s)
Wusiman Zaimuran of Shenzhen (CN)
PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18400022 titled 'PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE
Simplified Explanation
The abstract describes a printed circuit board with a core board covering and disposed on a substrate, including conductive layers and a flexible dielectric layer with a specific Young's modulus.
- The printed circuit board includes a core board and a substrate.
- The core board has a first conductive layer, a second conductive layer, and a first dielectric layer.
- The first conductive layer is on the outer side of the core board, away from the substrate.
- The second conductive layer is on the inner side of the core board, close to the substrate.
- The first dielectric layer includes a flexible dielectric layer with a Young's modulus less than or equal to a preset value.
Potential Applications
This technology could be used in electronic devices, such as smartphones, tablets, and computers, to improve the performance and reliability of printed circuit boards.
Problems Solved
This innovation solves the problem of rigid dielectric layers in traditional printed circuit boards, which can lead to mechanical stress and failure in electronic devices.
Benefits
The flexible dielectric layer in this printed circuit board design helps reduce mechanical stress, improve flexibility, and enhance the overall durability of electronic devices.
Potential Commercial Applications
"Flexible Dielectric Layer Printed Circuit Board for Enhanced Performance"
Possible Prior Art
There may be prior art related to flexible dielectric layers in printed circuit boards, but specific examples are not provided in this abstract.
Unanswered Questions
How does this technology compare to existing flexible printed circuit board designs in terms of performance and cost?
This article does not provide a direct comparison between this technology and existing flexible printed circuit board designs.
What are the specific electronic devices or industries that could benefit the most from this technology?
The abstract does not mention any specific electronic devices or industries that could benefit the most from this technology.
Original Abstract Submitted
Embodiments of this application provide a printed circuit board, including a core board and a substrate. The core board covers and is disposed on an outer surface of the substrate. The core board includes a first conductive layer, a second conductive layer, and a first dielectric layer. The first conductive layer is located on a side that is of the core board and that is away from the substrate, the second conductive layer is located on a side that is of the core board and that is close to the substrate, and the first dielectric layer is located between the first conductive layer and the second conductive layer, and includes a flexible dielectric layer whose Young's modulus is less than or equal to a preset Young's modulus.
