Samsung display co., ltd. (20240138065). ELECTRONIC APPARATUS simplified abstract

ELECTRONIC APPARATUS

Organization Name

samsung display co., ltd.

Inventor(s)

JAEJIN Oh of Gwangsan-gu (KR)

JUNHO Kwack of Geumsan-gun (KR)

DONGJIN Park of Seongnam-si (KR)

KYUNG-MOK Lee of Seoul (KR)

DONG-YOUB Lee of Cheonan-si (KR)

ELECTRONIC APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240138065 titled 'ELECTRONIC APPARATUS

Simplified Explanation

The patent application describes an electronic apparatus with a conductive adhesive member connecting a circuit board and an electronic panel, including various pads and leads for electrical connections.

• The electronic apparatus includes a circuit board and an electronic panel with a conductive adhesive member for electrical connection.
• The pads on the electronic panel include pixel pads, an arrangement pad, and a resistance measurement pad.
• The leads on the circuit board include pixel leads, an arrangement lead, and a resistance measurement lead.
• The resistance measurement lead connects with the resistance measurement pad and includes resistance measurement leads and a dummy lead.

Potential Applications

This technology could be applied in various electronic devices requiring precise electrical connections, such as display panels, touchscreens, or sensors.

Problems Solved

This innovation solves the challenge of establishing reliable and accurate electrical connections between a circuit board and an electronic panel in a compact and efficient manner.

Benefits

The benefits of this technology include improved electrical connectivity, reduced risk of signal interference, and enhanced overall performance of electronic devices.

Potential Commercial Applications

Potential commercial applications of this technology include consumer electronics, medical devices, automotive systems, and industrial equipment.

Possible Prior Art

One possible prior art could be the use of conductive adhesives in electronic devices for connecting circuit boards and panels. However, the specific arrangement of pads and leads described in this patent application may be a novel approach.

How does this technology compare to traditional soldering methods for electrical connections in terms of reliability and cost-effectiveness?

This article does not provide a direct comparison between this technology and traditional soldering methods. Further research or testing may be needed to evaluate the advantages and disadvantages of each approach.

What are the potential challenges or limitations of implementing this technology in mass production of electronic devices?

The article does not address the potential challenges or limitations of mass-producing electronic devices using this technology. Factors such as scalability, production costs, and compatibility with existing manufacturing processes could be important considerations.

Original Abstract Submitted

an electronic apparatus includes an electronic panel including a plurality of pads, a circuit board including a plurality of leads, and a conductive adhesive member configured to electrically connect the circuit board and the electronic panel. the plurality of pads include a plurality of pixel pads, an arrangement pad, and a resistance measurement pad disposed between the arrangement pad and the pixels pads and insulated from the pixel pads. the plurality of leads include a plurality of pixel leads, an arrangement lead, and a resistance measurement lead disposed between the pixel leads and the arrangement lead and insulated from the pixel leads. the resistance measurement lead includes a plurality of resistance measurement leads disposed between the arrangement lead and the pixel leads and electrically connected with the resistance measurement pad, and a dummy lead spaced apart from the plurality of resistance measurement leads in a plan view.