18071903. PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME
Organization Name
Inventor(s)
Kanggyune Lee of Suwon-si (KR)
Hyunggil Baek of Suwon-si (KR)
Youngja Kim of Cheonan-si (KR)
Seungjin Lee of Hwaseong-si (KR)
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18071903 titled 'PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME
Simplified Explanation
The abstract describes a printed circuit board that includes a substrate base, ball lands, a cutting position identification mark, and alignment marks. The ball lands are arranged on the surface of the substrate base, while the cutting position identification mark is located on a corner of the surface. The alignment marks are spaced apart from the ball lands and are exposed to the outside. The top surfaces of the ball lands and alignment marks are at the same vertical level, and they are made of the same material.
- The printed circuit board includes a substrate base.
- Ball lands are arranged on the surface of the substrate base.
- A cutting position identification mark is located on a corner of the surface of the substrate base.
- At least one alignment mark is present on the surface of the substrate base, spaced apart from the ball lands and exposed to the outside.
- The top surfaces of the ball lands and alignment marks are at the same vertical level.
- The ball lands and alignment marks are made of the same material.
Potential Applications
- Electronics manufacturing
- Circuit board assembly
Problems Solved
- Simplifies the identification and alignment process during circuit board assembly
- Provides a clear cutting position identification mark for accurate cutting of the board
Benefits
- Improved accuracy and efficiency in circuit board assembly
- Simplified identification and alignment process
- Consistent material composition for ball lands and alignment marks
Original Abstract Submitted
A printed circuit board includes a substrate base; a plurality of ball lands arranged on a surface of the substrate base; a cutting position identification mark disposed on a corner of the surface of the substrate base; and at least one alignment mark disposed on the surface of the substrate base to be spaced apart from the ball lands and exposed to the outside, wherein top surfaces of the ball lands and a top surface of the at least one alignment mark are at substantially the same vertical level and the ball lands and the at least one alignment mark include the same material.
