18525081. POWER ADAPTER AND ELECTRONIC DEVICE SYSTEM simplified abstract (Huawei Digital Power Technologies Co., Ltd.)
Contents
- 1 POWER ADAPTER AND ELECTRONIC DEVICE SYSTEM
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 POWER ADAPTER AND ELECTRONIC DEVICE SYSTEM - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
POWER ADAPTER AND ELECTRONIC DEVICE SYSTEM
Organization Name
Huawei Digital Power Technologies Co., Ltd.
Inventor(s)
POWER ADAPTER AND ELECTRONIC DEVICE SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 18525081 titled 'POWER ADAPTER AND ELECTRONIC DEVICE SYSTEM
Simplified Explanation
The patent application describes a power adapter with improved heat dissipation capabilities using insulation powder.
- The power adapter includes a housing, a printed circuit board assembly, and insulation powder filled in the housing.
- The printed circuit board assembly is fastened in the housing, and the insulation powder conducts heat generated by the printed circuit board assembly to the housing.
- The insulation powder does not have poor fluidity like thermally conductive adhesive, making it easier to fill sufficiently.
- This solution enhances the heat dissipation effect of the power adapter and can potentially increase the charging power of the adapter.
Potential Applications
The technology described in this patent application could be applied to various electronic devices that require efficient heat dissipation, such as laptops, smartphones, and tablets.
Problems Solved
This technology addresses the issue of heat buildup in power adapters, which can affect their performance and longevity. By improving heat dissipation, the power adapter can operate more efficiently and reliably.
Benefits
The use of insulation powder for heat dissipation can enhance the overall performance of the power adapter, potentially increasing its charging power and extending its lifespan.
Potential Commercial Applications
This technology could be valuable for manufacturers of electronic devices, particularly those producing power adapters for consumer electronics. By implementing this innovation, companies can offer more efficient and reliable products to their customers.
Possible Prior Art
One potential prior art for this technology could be the use of thermally conductive adhesives in power adapters for heat dissipation purposes.
Unanswered Questions
How does the insulation powder compare to other traditional heat dissipation methods in terms of cost-effectiveness?
Answer: The article does not provide information on the cost-effectiveness of using insulation powder compared to other heat dissipation methods.
Are there any potential drawbacks or limitations to using insulation powder for heat dissipation in power adapters?
Answer: The article does not mention any drawbacks or limitations associated with using insulation powder for heat dissipation in power adapters.
Original Abstract Submitted
This disclosure discloses a power adapter and an electronic device system, and relates to the field of heat dissipation technologies. The power adapter includes a housing, a printed circuit board assembly, and insulation powder filled in the housing. The printed circuit board assembly is fastened in the housing, and the insulation powder is used to conduct heat generated by the printed circuit board assembly to the housing. Compared with a thermally conductive adhesive, the insulation powder does not have a problem of poor fluidity, and can more easily be sufficiently filled. This solution improves heat dissipation effect of the power adapter and helps further increase a charging power of the power adapter.
