Intel corporation (20240130068). TECHNOLOGIES FOR A FLEXIBLE 3D POWER PLANE IN A CHASSIS simplified abstract
Contents
- 1 TECHNOLOGIES FOR A FLEXIBLE 3D POWER PLANE IN A CHASSIS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 TECHNOLOGIES FOR A FLEXIBLE 3D POWER PLANE IN A CHASSIS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
TECHNOLOGIES FOR A FLEXIBLE 3D POWER PLANE IN A CHASSIS
Organization Name
Inventor(s)
Zhichao Z. Zhang of Shanghai (CN)
Xiaoguo Liang of Shanghai (CN)
TECHNOLOGIES FOR A FLEXIBLE 3D POWER PLANE IN A CHASSIS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240130068 titled 'TECHNOLOGIES FOR A FLEXIBLE 3D POWER PLANE IN A CHASSIS
Simplified Explanation
The patent application describes technologies for a flexible three-dimensional power plane in a chassis. Here are some key points from the abstract:
- A flexible ribbon cable is laid along a circuit board tray.
- The flexible ribbon cable is secured to the tray using power bosses.
- The power bosses connect to one or more conductors on the ribbon cable.
- When the circuit board is mounted on the tray, the power bosses extend through holes in the circuit board and mate with power clips on the surface of the tray.
- The ribbon cable, power bosses, and power clips can distribute power to various locations on the circuit board without requiring large traces that take up space.
Potential Applications
This technology could be applied in various electronic devices and systems that require a flexible and efficient power distribution system, such as servers, data centers, and industrial equipment.
Problems Solved
This technology solves the problem of limited space on circuit boards due to large traces for power distribution. It also provides a flexible and adaptable power plane that can be easily integrated into different chassis designs.
Benefits
The benefits of this technology include efficient power distribution, space-saving design, flexibility in routing power, and ease of integration into different electronic systems.
Potential Commercial Applications
Potential commercial applications of this technology include server systems, networking equipment, industrial automation systems, and other electronic devices that require a flexible and efficient power distribution system.
Possible Prior Art
One possible prior art for this technology could be flexible printed circuit boards (PCBs) with embedded power distribution lines. However, the use of power bosses and clips for securing the ribbon cable and distributing power in a three-dimensional plane may be a novel aspect of this innovation.
Unanswered Questions
How does this technology compare to traditional power distribution methods in terms of efficiency and cost-effectiveness?
This article does not provide a direct comparison between this technology and traditional power distribution methods. Further research or testing may be needed to evaluate the efficiency and cost-effectiveness of this technology compared to existing methods.
What are the potential challenges or limitations of implementing this technology in different electronic systems or devices?
The article does not address potential challenges or limitations that may arise when implementing this technology in various electronic systems. Factors such as compatibility, scalability, and reliability could be important considerations that need to be explored further.
Original Abstract Submitted
technologies for a flexible three-dimensional power plane in a chassis are disclosed. in one embodiment, a flexible ribbon cable is laid along a circuit board tray. the flexible ribbon cable is secured to the tray using power bosses. the power bosses connect to one or more conductors on the ribbon cable. when the circuit board is mounted on the circuit board tray, the power bosses extend through holes in the circuit board and mate with power clips on the surface of the circuit board tray. the ribbon cable, power bosses, and power clips can distribute power to various locations on the circuit board, without requiring large traces that take up space on the circuit board.
