Dell products l.p. (20240098886). STRIP LINE DELAY MATCHING USING PRINTED DIELECTRIC MATERIAL simplified abstract

From WikiPatents
Jump to navigation Jump to search

STRIP LINE DELAY MATCHING USING PRINTED DIELECTRIC MATERIAL

Organization Name

dell products l.p.

Inventor(s)

Sandor Farkas of Round Rock TX (US)

Bhyrav Mutnury of Austin TX (US)

Timothy M. Lambert of Austin TX (US)

STRIP LINE DELAY MATCHING USING PRINTED DIELECTRIC MATERIAL - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240098886 titled 'STRIP LINE DELAY MATCHING USING PRINTED DIELECTRIC MATERIAL

Simplified Explanation

The patent application describes a printed circuit board with two insulating layers, strip line circuit traces, and a patterned dielectric material. The first strip line carries a signal, while the second strip line carries a signal and is longer than the first. The dielectric material delays the first signal relative to the second.

  • Two insulating layers
  • Strip line circuit traces on the first layer
  • Patterned dielectric material
  • Delay of signal on first strip line
  • Longer second strip line

Potential Applications

The technology described in this patent application could be applied in:

  • High-speed communication systems
  • Signal processing equipment
  • Radar systems

Problems Solved

This technology helps in:

  • Signal interference reduction
  • Signal delay management
  • Enhancing signal integrity

Benefits

The benefits of this technology include:

  • Improved signal quality
  • Enhanced circuit performance
  • Increased data transmission speeds

Potential Commercial Applications

The potential commercial applications of this technology could be in:

  • Telecommunications industry
  • Aerospace and defense sector
  • Electronics manufacturing companies

Possible Prior Art

One possible prior art for this technology could be:

  • Delay lines in communication systems

What are the potential manufacturing challenges for implementing this technology on a large scale?

Manufacturing challenges for implementing this technology on a large scale could include:

  • Ensuring uniformity of the dielectric material application
  • Precision in aligning the strip line circuit traces
  • Quality control to maintain signal integrity

How does this technology compare to existing signal delay solutions in terms of cost-effectiveness?

This technology may offer a cost-effective solution compared to existing signal delay solutions by:

  • Using standard manufacturing processes
  • Minimizing the need for additional components
  • Improving overall signal performance without significant added costs


Original Abstract Submitted

a printed circuit board includes first and second insulating layers, first and second strip line circuit traces formed on a surface of the first insulating layer, and a patterned dielectric material. the first strip line circuit trace has a first length and carries a first signal. the second strip line circuit trace is adjacent to the first strip line circuit trace, has a second length longer than the first length, and carries a second signal. the patterned dielectric material is provided over a portion of the first length to delay the first signal relative to the second signal. the second insulating layer is affixed to the surface and covers the first and second strip line circuit traces and the patterned dielectric material.