Qualcomm incorporated (20240106115). LOW-LOSS SMALL FORM-FACTOR BUTLER MATRIX simplified abstract

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LOW-LOSS SMALL FORM-FACTOR BUTLER MATRIX

Organization Name

qualcomm incorporated

Inventor(s)

Haim Weissman of Haifa (IL)

Idan Michael Horn of Hod Hasharon (IL)

Elimelech Ganchrow of Zichron Yaakov (IL)

LOW-LOSS SMALL FORM-FACTOR BUTLER MATRIX - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240106115 titled 'LOW-LOSS SMALL FORM-FACTOR BUTLER MATRIX

Simplified Explanation

The abstract describes techniques for reducing the form factor and insertion losses of beamforming networks, specifically for feeding a phased array of antenna elements. The network includes microstrip elements on different layers of a printed circuit board, a metal layer between the layers, and vias for coupling the elements.

  • The beamforming network is configured to feed a phased array of antenna elements.
  • The network includes microstrip elements on different layers of a printed circuit board.
  • A metal layer is placed between the layers of microstrip elements.
  • Vias are used to couple elements on different layers of the board.

Potential Applications

This technology could be applied in:

  • Radar systems
  • Satellite communication systems
  • Wireless communication networks

Problems Solved

This technology helps in:

  • Reducing form factor of beamforming networks
  • Minimizing insertion losses
  • Improving signal transmission efficiency

Benefits

The benefits of this technology include:

  • Enhanced performance of phased array systems
  • Compact design for space-constrained applications
  • Improved signal quality and coverage

Potential Commercial Applications

Potential commercial applications of this technology could be in:

  • 5G networks
  • Military communications
  • Autonomous vehicles

Possible Prior Art

One possible prior art could be:

  • Traditional beamforming networks with larger form factors and higher insertion losses

What are the limitations of the proposed technology in real-world applications?

The proposed technology may face limitations in terms of:

  • Compatibility with existing systems
  • Cost-effectiveness of implementation

How does this technology compare to similar solutions on the market?

This technology offers:

  • Reduced form factor compared to traditional beamforming networks
  • Lower insertion losses for improved signal transmission efficiency


Original Abstract Submitted

techniques are provided for reducing the form factor and insertion losses of beamforming networks. an example beamforming network configured to feed a phased array of antenna elements includes a first group of microstrip elements on a first layer of a printed circuit board, a second group of microstrip elements on a second layer of the printed circuit board, a metal layer disposed between the first layer and the second layer, and a plurality of vias configured to couple one or more elements in the first group of microstrip elements with one or more elements in the second group of microstrip elements.