Meta platforms technologies, llc (20240098877). STACK-PCB ARCHITECTURE WITH EMBEDDED VAPOR CHAMBER simplified abstract

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STACK-PCB ARCHITECTURE WITH EMBEDDED VAPOR CHAMBER

Organization Name

meta platforms technologies, llc

Inventor(s)

Michael Nikkhoo of Saratoga CA (US)

Brian Toleno of Cupertino CA (US)

Patrick Codd of Carnation WA (US)

STACK-PCB ARCHITECTURE WITH EMBEDDED VAPOR CHAMBER - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240098877 titled 'STACK-PCB ARCHITECTURE WITH EMBEDDED VAPOR CHAMBER

Simplified Explanation

The patent application describes an interposer equipped with a heat spreader and a multi-board system for an electronic device. The interposer is positioned between at least two boards and includes a heat spreader with an active portion and a passive portion. The active portion may contain a vapor chamber, heat pipe, or isothermal plate, while the passive portion thermally couples the active portion to a heat dissipation device such as a heat sink or an outer frame of the electronic device.

  • The interposer is equipped with a heat spreader that includes an active portion and a passive portion.
  • The active portion of the heat spreader may contain a vapor chamber, heat pipe, or isothermal plate.
  • The passive portion of the heat spreader thermally couples the active portion to a heat dissipation device.
  • The interposer is positioned between at least two boards in the electronic device.

Potential Applications

The technology described in the patent application could be applied in:

  • High-performance computing systems
  • Data centers
  • Telecommunications equipment

Problems Solved

This technology addresses the following issues:

  • Efficient heat dissipation in electronic devices
  • Thermal management in multi-board systems
  • Prevention of overheating and component damage

Benefits

The benefits of this technology include:

  • Improved thermal performance
  • Enhanced reliability of electronic devices
  • Extended lifespan of components

Potential Commercial Applications

The technology could be commercially applied in:

  • Server systems
  • Networking equipment
  • Industrial control systems

Possible Prior Art

One possible prior art for this technology could be the use of heat spreaders in electronic devices to improve thermal management. Additionally, the integration of heat pipes or vapor chambers for heat dissipation may have been previously explored in similar applications.

Unanswered Questions

How does the interposer impact the overall size and weight of the electronic device?

The patent application does not provide specific details on the size and weight implications of incorporating the interposer with a heat spreader. Further information on the physical dimensions and weight of the device would be helpful for understanding its practical implementation.

What materials are used in the construction of the heat spreader and interposer?

The patent application does not specify the materials used in the construction of the heat spreader and interposer. Knowledge of the materials could provide insights into the thermal conductivity and overall performance of the system.


Original Abstract Submitted

an interposer equipped with a heat spreader and a multi-board system for an electronic device that includes an interposer equipped with a heat spreader between at least two boards. in examples, the interposer may include a heat spreader having an active portion and, optionally, a passive portion. in examples, the active portion may include a vapor chamber, heat pipe, or isothermal plate. in examples, the passive portion may thermally couple the active portion to a heat dissipation device such as a heat sink and/or an outer frame of the electronic device.

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