17967532. PRINTED CIRCUIT BOARD WITH INCREASED DURABILITY IN BENDING REGION AND ELECTRONIC DEVICE INCLUDING SAME simplified abstract (Samsung Electronics Co., Ltd.)
PRINTED CIRCUIT BOARD WITH INCREASED DURABILITY IN BENDING REGION AND ELECTRONIC DEVICE INCLUDING SAME
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PRINTED CIRCUIT BOARD WITH INCREASED DURABILITY IN BENDING REGION AND ELECTRONIC DEVICE INCLUDING SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17967532 titled 'PRINTED CIRCUIT BOARD WITH INCREASED DURABILITY IN BENDING REGION AND ELECTRONIC DEVICE INCLUDING SAME
Simplified Explanation
The patent application describes a printed circuit board with an extending region and a bending region. The extending region and the bending region have a non-conductive layer, a first conductive layer, a second conductive layer, and at least one via hole.
- The printed circuit board has an extending region and a bending region.
- The extending region and the bending region have a non-conductive layer, a first conductive layer, a second conductive layer, and at least one via hole.
- The via hole penetrates the non-conductive layer, the first conductive layer, and the second conductive layer.
- In the bending region, the cross-sectional area of the via hole in contact with the first conductive layer is smaller than the cross-sectional area of the via hole in contact with the second conductive layer.
Potential applications of this technology:
- Flexible electronic devices
- Wearable technology
- Foldable displays
- Curved circuit boards
Problems solved by this technology:
- Allows for bending and flexibility in circuit boards
- Reduces stress on the via holes during bending
- Improves the durability and reliability of the circuit board
Benefits of this technology:
- Enables the creation of more compact and lightweight electronic devices
- Enhances the design possibilities for electronic products
- Increases the lifespan of the circuit board by reducing damage caused by bending and flexing.
Original Abstract Submitted
A printed circuit board is provided. The printed circuit board includes: an extending region extending along one direction, and a bending region configured to bend with respect to the extending region. The extending region and the bending region includes a non-conductive layer, a first conductive layer disposed on one surface of the non-conductive layer, a second conductive layer disposed on the other surface of the non-conductive layer, and at least one via hole penetrating the non-conductive layer, the first conductive layer, and the second conductive layer. In the bending region, a cross-sectional area of the via hole in contact with the first conductive layer is less than a cross-sectional area of the via hole in contact with the second conductive layer.
