18091368. ELECTRONIC DEVICE INCLUDING PRINTED CIRCUIT BOARD STRUCTURE INCLUDING THERMAL INTERFACE MATERIAL simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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ELECTRONIC DEVICE INCLUDING PRINTED CIRCUIT BOARD STRUCTURE INCLUDING THERMAL INTERFACE MATERIAL

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Kyuhwan Lee of Suwon-si, (KR)

Min Park of Suwon-si (KR)

Haejin Lee of Suwon-si (KR)

Jaeheung Ye of Suwon-si (KR)

Yeonkyung Chung of Suwon-si (KR)

ELECTRONIC DEVICE INCLUDING PRINTED CIRCUIT BOARD STRUCTURE INCLUDING THERMAL INTERFACE MATERIAL - A simplified explanation of the abstract

This abstract first appeared for US patent application 18091368 titled 'ELECTRONIC DEVICE INCLUDING PRINTED CIRCUIT BOARD STRUCTURE INCLUDING THERMAL INTERFACE MATERIAL

Simplified Explanation

The abstract describes an electronic device with a printed circuit board (PCB) structure that incorporates a thermal interface material (TIM). The PCB structure includes a base plate, two components, an interposer, a cover plate, and an accommodation part for the TIM.

  • The electronic device has a PCB structure that houses a thermal interface material (TIM).
  • The PCB structure consists of a base plate, two components, an interposer, a cover plate, and an accommodation part for the TIM.
  • The first component is placed on the base plate, while the second component is separate from the first component.
  • The interposer is connected to the base plate and surrounds both the first and second components.
  • The cover plate is connected to the interposer and covers both the first and second components.
  • The accommodation part is located between the base plate and a heat conduction plate and is designed to hold the TIM.

Potential Applications

  • This technology can be applied in various electronic devices that require efficient thermal management, such as computers, smartphones, and servers.
  • It can be used in high-performance devices that generate a significant amount of heat, ensuring proper cooling and preventing overheating.

Problems Solved

  • The incorporation of a thermal interface material helps to improve heat dissipation and thermal conductivity within the electronic device.
  • The design of the PCB structure with the interposer and cover plate provides better thermal management and protection for the components.

Benefits

  • Enhanced thermal management capabilities result in improved performance and reliability of the electronic device.
  • The use of a thermal interface material helps to prevent overheating and potential damage to the components.
  • The PCB structure with the interposer and cover plate offers better protection against external factors and physical damage.


Original Abstract Submitted

An electronic device includes a printed circuit board (“PCB”) structure which accommodates a thermal interface material (“TIM”). The PCB structure includes a base plate, a first component on the base plate, a second component on the base plate and apart from the first component, an interposer connected to the base plate and surrounding the first component and the second component, a cover plate connected to the interposer and covering the first component and the second component, and an accommodation part which is between the base plate and a heat conduction plate and accommodates the TIM.

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