17848092. STACK-PCB ARCHITECTURE WITH EMBEDDED VAPOR CHAMBER simplified abstract (Meta Platforms Technologies, LLC)
Contents
- 1 STACK-PCB ARCHITECTURE WITH EMBEDDED VAPOR CHAMBER
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 STACK-PCB ARCHITECTURE WITH EMBEDDED VAPOR CHAMBER - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
STACK-PCB ARCHITECTURE WITH EMBEDDED VAPOR CHAMBER
Organization Name
Meta Platforms Technologies, LLC
Inventor(s)
Michael Nikkhoo of Saratoga CA (US)
Brian Toleno of Cupertino CA (US)
Patrick Codd of Carnation WA (US)
STACK-PCB ARCHITECTURE WITH EMBEDDED VAPOR CHAMBER - A simplified explanation of the abstract
This abstract first appeared for US patent application 17848092 titled 'STACK-PCB ARCHITECTURE WITH EMBEDDED VAPOR CHAMBER
Simplified Explanation
The patent application describes an interposer equipped with a heat spreader and a multi-board system for an electronic device, facilitating efficient heat dissipation between boards.
- The interposer includes a heat spreader with an active portion, which may consist of a vapor chamber, heat pipe, or isothermal plate.
- The interposer may also have a passive portion that thermally couples the active portion to a heat dissipation device like a heat sink or the outer frame of the electronic device.
Potential Applications
The technology could be applied in various electronic devices such as servers, computers, and mobile devices to enhance thermal management and improve overall performance.
Problems Solved
1. Efficient heat dissipation between boards in electronic devices. 2. Enhanced thermal management to prevent overheating and potential damage to components.
Benefits
1. Improved performance and reliability of electronic devices. 2. Enhanced thermal efficiency leading to longer lifespan of components. 3. Cost-effective solution for thermal management in multi-board systems.
Potential Commercial Applications
Optimizing thermal management in servers, computers, and mobile devices for improved performance and reliability.
Possible Prior Art
One possible prior art could be the use of heat spreaders and interposers in electronic devices to manage heat dissipation between components. However, the specific combination of an interposer with a heat spreader and a multi-board system as described in the patent application may be a novel innovation.
Unanswered Questions
How does the technology impact the overall size and form factor of electronic devices?
The article does not provide information on whether the addition of the interposer with a heat spreader affects the size or form factor of the electronic device.
What materials are used in the construction of the interposer and heat spreader?
The article does not specify the materials used in the construction of the interposer and heat spreader, which could impact the effectiveness and cost of the technology.
Original Abstract Submitted
An interposer equipped with a heat spreader and a multi-board system for an electronic device that includes an interposer equipped with a heat spreader between at least two boards. In examples, the interposer may include a heat spreader having an active portion and, optionally, a passive portion. In examples, the active portion may include a vapor chamber, heat pipe, or isothermal plate. In examples, the passive portion may thermally couple the active portion to a heat dissipation device such as a heat sink and/or an outer frame of the electronic device.
