18323880. ELECTRONIC DEVICE INCLUDING HEAT PIPE SURROUNDING MULTIPLE INTEGRATED CIRCUITS simplified abstract (Samsung Electronics Co., Ltd.)
ELECTRONIC DEVICE INCLUDING HEAT PIPE SURROUNDING MULTIPLE INTEGRATED CIRCUITS
Organization Name
Inventor(s)
Sangchul Jung of Suwon-si (KR)
ELECTRONIC DEVICE INCLUDING HEAT PIPE SURROUNDING MULTIPLE INTEGRATED CIRCUITS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18323880 titled 'ELECTRONIC DEVICE INCLUDING HEAT PIPE SURROUNDING MULTIPLE INTEGRATED CIRCUITS
Simplified Explanation
The abstract describes an electronic device with a printed circuit board (PCB) that includes a processor, a heat sink, and two integrated circuits (ICs) on different surfaces connected by a heat pipe.
- The electronic device has a PCB with a processor and a heat sink on one surface.
- There are two ICs on the opposite surface of the PCB, with a heat pipe connecting them.
- The heat pipe surrounds the ICs on one end and extends to the heat sink on the other end.
Potential Applications
- Consumer electronics
- Computer hardware
- Industrial machinery
Problems Solved
- Efficient heat dissipation for electronic components
- Space-saving design for compact devices
Benefits
- Improved performance and longevity of electronic devices
- Enhanced thermal management
- Compact and efficient design for various applications
Original Abstract Submitted
An electronic device is provided. The electronic device includes a printed circuit board (PCB) comprising a first surface and a second surface opposite to the first surface. The electronic device includes a processor on the second surface. The electronic device includes a heat sink on the second surface, partially contacted on the processor. The electronic device includes a first integrated circuit (IC) on the first surface. The electronic device includes a second IC on the first surface spaced apart from the first IC. The electronic device includes a heat pipe including a first portion surrounding the first IC and the second IC when viewing the first surface in a second direction opposite to a first direction that the first surface faces, and a second portion extended from the first portion to the heat sink.
