18530179. MICROELECTRONIC DEVICE PACKAGE INCLUDING ANTENNA AND SEMICONDUCTOR DEVICE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
Contents
- 1 MICROELECTRONIC DEVICE PACKAGE INCLUDING ANTENNA AND SEMICONDUCTOR DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MICROELECTRONIC DEVICE PACKAGE INCLUDING ANTENNA AND SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
MICROELECTRONIC DEVICE PACKAGE INCLUDING ANTENNA AND SEMICONDUCTOR DEVICE
Organization Name
TEXAS INSTRUMENTS INCORPORATED
Inventor(s)
Rajen Manicon Murugan of Dallas TX (US)
Juan Alejandro Herbsommer of Allen TX (US)
MICROELECTRONIC DEVICE PACKAGE INCLUDING ANTENNA AND SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18530179 titled 'MICROELECTRONIC DEVICE PACKAGE INCLUDING ANTENNA AND SEMICONDUCTOR DEVICE
Simplified Explanation
The abstract describes an innovation where an antenna is formed in a first conductor layer on a device side surface of a multilayer package substrate, with the substrate having conductor layers separated by dielectric material and connected by conductive vertical connection layers. A semiconductor die is mounted on the device side surface of the substrate, spaced from and coupled to the antenna.
- Antenna formed in a first conductor layer on a device side surface of a multilayer package substrate
- Substrate includes conductor layers separated by dielectric material and connected by conductive vertical connection layers
- Semiconductor die mounted on the device side surface of the substrate, spaced from and coupled to the antenna
Potential Applications
This technology could be applied in:
- Wireless communication devices
- IoT devices
- RFID systems
Problems Solved
This technology helps in:
- Improving signal reception and transmission
- Integrating antennas in compact electronic devices
- Enhancing connectivity in small form factor devices
Benefits
The benefits of this technology include:
- Improved wireless communication performance
- Space-saving design for compact devices
- Enhanced connectivity in multilayer package substrates
Potential Commercial Applications
Commercial applications for this technology may include:
- Smartphones and tablets
- Wearable technology
- Automotive electronics
Possible Prior Art
One possible prior art for this technology could be:
- Antennas integrated into multilayer package substrates in electronic devices
Unanswered Questions
How does this technology impact the overall size of electronic devices?
This technology could potentially reduce the overall size of electronic devices by integrating the antenna within the multilayer package substrate, saving space for other components.
What are the potential challenges in manufacturing devices with this technology?
Manufacturing devices with this technology may pose challenges in ensuring precise alignment and connection between the antenna, semiconductor die, and the multilayer package substrate. Additionally, optimizing the performance of the antenna within the substrate may require specialized manufacturing processes.
Original Abstract Submitted
A described example includes an antenna formed in a first conductor layer on a device side surface of a multilayer package substrate, the multilayer package substrate including conductor layers spaced from one another by dielectric material and coupled to one another by conductive vertical connection layers, the multilayer package substrate having a board side surface opposite the device side surface; and a semiconductor die mounted to the device side surface of the multilayer package substrate spaced from and coupled to the antenna.
