18039454. CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME simplified abstract (LG INNOTEK CO., LTD.)
Contents
- 1 CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
Organization Name
Inventor(s)
CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18039454 titled 'CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
Simplified Explanation
The circuit board described in the abstract features a via with a wider upper surface than lower surface, with the lower surface being 75% to 95% of the width of the upper surface.
- The via in the circuit board has an upper surface that is wider than its lower surface.
- The lower surface of the via is 75% to 95% of the width of the upper surface.
Potential Applications
This technology could be applied in various electronic devices and systems that require efficient signal transmission and power distribution.
Problems Solved
This innovation helps in improving signal integrity and reducing signal loss in circuit boards, leading to better overall performance of electronic devices.
Benefits
- Enhanced signal transmission efficiency - Reduced signal loss - Improved overall performance of electronic devices
Potential Commercial Applications
Optimizing circuit boards for better signal transmission and power distribution in smartphones, computers, IoT devices, and other electronic systems.
Possible Prior Art
There may be prior art related to optimizing via structures in circuit boards for improved signal transmission efficiency and reduced signal loss.
Unanswered Questions
How does this technology impact the overall cost of manufacturing electronic devices?
This article does not address the potential cost implications of implementing this technology in circuit board production.
Are there any limitations to the size or complexity of circuit boards that can benefit from this innovation?
The article does not discuss any restrictions or limitations on the size or complexity of circuit boards that can incorporate this technology.
Original Abstract Submitted
A circuit board according to an embodiment includes an insulating layer; and a via formed in the insulating layer; wherein a width of an upper surface of the via is greater than a width of a lower surface of the via, and wherein the width of the lower surface of the via is 75% to 95% of the width of the upper surface of the via.
