Samsung electronics co., ltd. (20240098940). PRINTED CIRCUIT BOARD ASSEMBLY INCLUDING THERMAL MODULE simplified abstract
Contents
- 1 PRINTED CIRCUIT BOARD ASSEMBLY INCLUDING THERMAL MODULE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PRINTED CIRCUIT BOARD ASSEMBLY INCLUDING THERMAL MODULE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
PRINTED CIRCUIT BOARD ASSEMBLY INCLUDING THERMAL MODULE
Organization Name
Inventor(s)
PRINTED CIRCUIT BOARD ASSEMBLY INCLUDING THERMAL MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240098940 titled 'PRINTED CIRCUIT BOARD ASSEMBLY INCLUDING THERMAL MODULE
Simplified Explanation
The abstract describes a patent application for a printed circuit board (PCB) assembly that includes a thermal module to absorb heat from an electronic component and a pressurizing structure to apply pre-load to the thermal module towards the electronic component.
- The PCB assembly includes a first circuit board with an electronic component, a second circuit board connected to the first circuit board, a thermal module, and a pressurizing structure.
- The thermal module is designed to absorb heat from the electronic component to prevent overheating.
- The pressurizing structure applies pre-load to the thermal module in the direction of the electronic component to enhance heat dissipation.
- The pressurizing structure is separate from the second circuit board and is supported by the first circuit board or an external structure.
Potential Applications
The technology described in the patent application could be applied in various electronic devices and systems where heat dissipation from electronic components is crucial, such as:
- High-performance computers
- Servers
- Industrial machinery
- Automotive electronics
Problems Solved
The innovation addresses the issue of overheating in electronic components by providing an efficient heat dissipation solution through the use of a thermal module and a pressurizing structure.
Benefits
Some benefits of this technology include:
- Improved thermal management
- Enhanced performance and reliability of electronic components
- Extended lifespan of electronic devices
- Reduced risk of overheating-related malfunctions
Potential Commercial Applications
The technology could have commercial applications in industries such as:
- Electronics manufacturing
- Computer hardware
- Automotive technology
- Industrial equipment
Possible Prior Art
One possible prior art could be the use of heat sinks and fans for cooling electronic components in PCB assemblies. However, the specific combination of a thermal module and a pressurizing structure as described in the patent application may be a novel approach to address heat dissipation issues.
Unanswered Questions
How does the pressurizing structure interact with the thermal module to enhance heat dissipation?
The specific mechanism by which the pressurizing structure applies pre-load to the thermal module towards the electronic component for improved heat dissipation is not detailed in the abstract.
What materials are used in the construction of the thermal module and pressurizing structure?
The abstract does not mention the materials used in the thermal module and pressurizing structure, which could impact their effectiveness in heat dissipation.
Original Abstract Submitted
a printed circuit board (pcb) assembly includes a first circuit board, an electronic component provided on the first circuit board, a second circuit board connected to the first circuit board, a thermal module configured to absorb heat from the electronic component, and a pressurizing structure configured to apply a pre-load to the thermal module in a direction toward the electronic component, where the pressurizing structure is separated from the second circuit board and is supported by the first circuit board or an external structure.
