18225944. Methods and Structures for Coupling Thermal Dissipating Elements and Thermal Cooling Structures to Integrated Circuit Dies simplified abstract (GOOGLE LLC)

Methods and Structures for Coupling Thermal Dissipating Elements and Thermal Cooling Structures to Integrated Circuit Dies

Organization Name

GOOGLE LLC

Inventor(s)

Yingshi Tang of Danville CA (US)

Yingying Wang of Sunnyvale CA (US)

Padam Jain of San Jose CA (US)

Emad Samadiani of Cypress CA (US)

Sudharshan Sugavanesh Udhayakumar of San Jose CA (US)

Madhusudan K. Iyengar of Foster City CA (US)

Methods and Structures for Coupling Thermal Dissipating Elements and Thermal Cooling Structures to Integrated Circuit Dies - A simplified explanation of the abstract

This abstract first appeared for US patent application 18225944 titled 'Methods and Structures for Coupling Thermal Dissipating Elements and Thermal Cooling Structures to Integrated Circuit Dies

Simplified Explanation

The abstract describes methods and structures for placing thermal dissipating elements on integrated circuit dies, such as pin fins, using a pin fin placement assembly and a vacuum pickup assembly. The pin fin placement assembly includes plates with apertures for receiving the pin fins and can be incorporated into a thermal cooling structure with a manifold to encase the IC die and attached pin fins.

• Pin fin placement assembly with plates and apertures for simultaneous placement of multiple pin fins on desired locations of the IC die.
• Vacuum pickup assembly used to assist with the placement of the pin fins.
• Thermal cooling structure incorporating the pin fin placement assembly and a manifold to encase the IC die and attached pin fins.

Potential Applications

The technology described in the patent application could be applied in the following areas:

• Electronic devices requiring efficient thermal management, such as smartphones, laptops, and servers.
• High-performance computing systems where heat dissipation is crucial for maintaining optimal performance.

Problems Solved

The technology addresses the following issues:

• Ensuring effective thermal dissipation on integrated circuit dies to prevent overheating and potential damage.
• Facilitating the placement of multiple pin fins with desired profiles on specific locations of the IC die.

Benefits

The technology offers the following benefits:

• Improved thermal management for integrated circuits, leading to enhanced performance and reliability.
• Simplified and efficient process for placing thermal dissipating elements on IC dies.

Potential Commercial Applications

The technology could find commercial applications in:

• Semiconductor manufacturing companies looking to enhance the thermal performance of their products.
• Electronics companies producing high-performance devices that require effective heat dissipation solutions.

Possible Prior Art

One possible prior art for this technology could be the use of heat sinks or other thermal management solutions on integrated circuits. However, the specific method of using a pin fin placement assembly and a vacuum pickup assembly for simultaneous placement of pin fins may be a novel approach.

Original Abstract Submitted

Methods and structures for providing thermal dissipating elements on integrated circuit (“IC”) dies are disclosed. A thermal dissipating element placement assembly, such as a pin fin placement assembly, along with a vacuum pickup assembly, can be used to assist with simultaneous placement of multiple pin fins with desired profiles on desired locations of the IC die. The pin fin placement assembly may be comprised of one or more plates with a plurality of apertures therein for receiving the pin fins. The pin fin placement assembly can be further incorporated into a thermal cooling structure, which can include a manifold configured to encase the IC die and attached pin fins.